Patents by Inventor Max Jedda

Max Jedda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatuses for improved positioning in a probing system
    Patent number: 7852097
    Abstract: An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: December 14, 2010
    Inventors: Uday Nayak, Xiaolan Zhang, George Asmerom, Max Jedda
  • Methods and apparatuses for improved stabilization in a probing system
    Patent number: 7622939
    Abstract: Improved methods and apparatuses for automatically and accurately maintaining the alignment of a wafer prober to the bonding pads of a semiconductor device in the presence of motion disturbances are provided. In one embodiment of one aspect of the invention, a feedback control system incorporating information from a number of acceleration and/or velocity sensors is used to maintain the desired contact position in the presence of motion disturbances. Other aspects and other embodiments are also described.
    Type: Grant
    Filed: October 18, 2007
    Date of Patent: November 24, 2009
    Inventors: Uday Nayak, Richard James Casler, Jr., Max Jedda
  • METHODS AND APPARATUSES FOR IMPROVED POSITIONING IN A PROBING SYSTEM
    Publication number: 20080150565
    Abstract: An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
    Type: Application
    Filed: March 4, 2008
    Publication date: June 26, 2008
    Inventors: Uday Nayak, Xiaolan Zhang, George Asmerom, Max Jedda
  • Methods and apparatuses for improved positioning in a probing system
    Patent number: 7368929
    Abstract: An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: May 6, 2008
    Assignee: Electroglas, Inc.
    Inventors: Uday Nayak, Xiaolan Zhang, George Asmerom, Max Jedda
  • METHODS AND APPARATUSES FOR IMPROVED STABILIZATION IN A PROBING SYSTEM
    Publication number: 20080100321
    Abstract: Improved methods and apparatuses for automatically and accurately maintaining the alignment of a wafer prober to the bonding pads of a semiconductor device in the presence of motion disturbances are provided. In one embodiment of one aspect of the invention, a feedback control system incorporating information from a number of acceleration and/or velocity sensors is used to maintain the desired contact position in the presence of motion disturbances. Other aspects and other embodiments are also described.
    Type: Application
    Filed: October 18, 2007
    Publication date: May 1, 2008
    Inventors: Uday Nayak, Richard Casler, Max Jedda
  • Methods and apparatuses for improved stabilization in a probing system
    Patent number: 7352198
    Abstract: Improved methods and apparatuses for automatically and accurately maintaining the alignment of a wafer prober to the bonding pads of a semiconductor device in the presence of motion disturbances are provided. In one embodiment of one aspect of the invention, a feedback control system incorporating information from a number of acceleration and/or velocity sensors is used to maintain the desired contact position in the presence of motion disturbances. Other aspects and other embodiments are also described.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: April 1, 2008
    Assignee: Electroglas, Inc.
    Inventors: Uday Nayak, Richard James Casler, Jr., Max Jedda
  • Methods and apparatuses for improved stabilization in a probing system
    Publication number: 20070164760
    Abstract: Improved methods and apparatuses for automatically and accurately maintaining the alignment of a wafer prober to the bonding pads of a semiconductor device in the presence of motion disturbances are provided. In one embodiment of one aspect of the invention, a feedback control system incorporating information from a number of acceleration and/or velocity sensors is used to maintain the desired contact position in the presence of motion disturbances. Other aspects and other embodiments are also described.
    Type: Application
    Filed: January 18, 2006
    Publication date: July 19, 2007
    Inventors: Uday Nayak, Richard Casler, Max Jedda
  • Methods and apparatuses for improved positioning in a probing system
    Publication number: 20070164762
    Abstract: An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
    Type: Application
    Filed: January 18, 2006
    Publication date: July 19, 2007
    Inventors: Uday Nayak, Xiaolan Zhang, George Asmerom, Max Jedda