Abstract: An apparatus for memory error control coding comprising a first circuit and a second circuit. The first circuit may be configured to generate a multi-bit digital syndrome signal in response to a read data signal and a read parity signal. The second circuit may be configured to (i) detect an error when the bits of the syndrome signal are not all the same state and (ii) generate an error location signal in response the syndrome signal. The error location signal may be generated in response to fewer than all of the bits of the syndrome signal.

Abstract: A packaged circuit with VDDcore contacts in first positions and VSScore contacts in second positions. A redistribution layer is adjacent the integrated circuit, and overlies VDDcore and VSScore mesh layers. First contacts in the redistribution layer are positioned in alignment with the first positions, to make connections between the redistribution layer and the VDDcore contacts. Second contacts are positioned in alignment with the second positions, to make connections between the redistribution layer and the VSScore contacts. First vias are positioned in alignment with the first positions, to make connections between the first contacts and the VDD mesh layer. The traces of the VDD mesh layer are positioned in alignment with the first positions. Second vias are positioned in alignment with the second positions to make connections between the second contacts and the VSS mesh layer. The traces of the VSS mesh layer are positioned in alignment with the second positions.

Abstract: A method of increasing mechanical interlocking between a first structure and a second adjacent structure in an integrated circuit. The first structure is formed with a first surface having a first horizontal component, and the second structure is formed with a second surface having a second horizontal component. The first surface laterally engages the second surface and the first horizontal component is complementary to the second horizontal component, such that the first structure prohibits vertical movement of the second structure.

Abstract: A method for designing an input output cell of an integrated circuit. The input output cell has a required area, a width, and a height. The bonding pad pitch length between adjacent bonding pads of the integrated circuit is measured. The width of the input output cell is specified to be substantially equal to the bonding pad pitch length. The required area is divided by the width to determine a first value, and the height of the input output cell is specified to be substantially equal to the first value. In this manner, the width of the input output cells is no greater than the distance between two adjacent bonding pads, and thus the input output cells can be placed very close together, facilitating their use in input output limited integrated circuit designs. However, the height of the input output cells is no greater than is necessary to enclose the required area of the input output cell, thus facilitating their use in core limited integrated circuit designs.

Abstract: A method of increasing mechanical interlocking between a first structure and a second adjacent structure in an integrated circuit. The first structure is formed with a first surface having a first horizontal component, and the second structure is formed with a second surface having a second horizontal component. The first surface laterally engages the second surface and the first horizontal component is complementary to the second horizontal component, such that the first structure prohibits vertical movement of the second structure.

Abstract: An integrated circuit with a VDDio bus line disposed on a first layer of the integrated circuit. The VDDio bus line is disposed along a length, and has a first width transverse to the length. A VSSio bus line is dispose on a second layer of the integrated circuit. The VSSio bus line is disposed along the length and has a second width transverse to the length. The second width of the VSSio bus line substantially overlaps the first width of the VDDio bus line. An input output cell is disposed on a third layer of the integrated circuit. The first layer, the second layer, and the third layer are all different layers of the integrated circuit. The input output cell has a first transistor electrically connected to the VDDio bus line, and a second transistor electrically connected to the VSSio bus line. The first transistor and the second transistor are disposed along the length within the input output cell.

Abstract: An integrated circuit with a VDDio bus line disposed on a first layer of the integrated circuit. The VDDio bus line is disposed along a length, and has a first width transverse to the length. A VSSio bus line is dispose on a second layer of the integrated circuit. The VSSio bus line is disposed along the length and has a second width transverse to the length. The second width of the VSSio bus line substantially overlaps the first width of the VDDio bus line. An input output cell is disposed on a third layer of the integrated circuit. The first layer, the second layer, and the third layer are all different layers of the integrated circuit. The input output cell has a first transistor electrically connected to the VDDio bus line, and a second transistor electrically connected to the VSSio bus line. The first transistor and the second transistor are disposed along the length within the input output cell.

Abstract: A packaged circuit with VDDcore contacts in first known positions and VSScore contacts in second known positions. A VDDcore mesh layer is fabricated with traces, and a VSScore mesh layer is fabricated with traces. A redistribution layer is disposed adjacent the integrated circuit, and overlies the VDDcore mesh layer and the VSScore mesh layer. First contacts in the redistribution layer are positioned in alignment with the first known positions, to make electrical connections between the redistribution layer and the VDDcore contacts. Second contacts are positioned in alignment with the second known positions, to make electrical connections between the redistribution layer and the VSScore contacts. First electrically conductive vias are positioned in alignment with the first known positions, to make electrical connections between the first contacts and the VDD mesh layer, without using a VDDcore bus that extends substantially across the redistribution layer.

Abstract: A method for designing an input output cell of an integrated circuit. The input output cell has a required area, a width, and a height. The bonding pad pitch length between adjacent bonding pads of the integrated circuit is measured. The width of the input output cell is specified to be substantially equal to the bonding pad pitch length. The required area is divided by the width to determine a first value, and the height of the input output cell is specified to be substantially equal to the first value. In this manner, the width of the input output cells is no greater than the distance between two adjacent bonding pads, and thus the input output cells can be placed very close together, facilitating their use in input output limited integrated circuit designs. However, the height of the input output cells is no greater than is necessary to enclose the required area of the input output cell, thus facilitating their use in core limited integrated circuit designs.