Patents by Inventor Max M. Young

Max M. Young has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6836026
    Abstract: Various integrated circuits (ICs) are provided. One IC includes bonding pads and an input output (I/O) region surrounding a core region. The I/O region includes I/O cells having a width approximately equal to or less than a width of the bonding pads. The IC also includes core logic arranged within the I/O region. Another IC includes four rows of bonding pads. Each row is arranged parallel to a different side of a core region. I/O sub-regions are arranged proximate each side of the core region. Each I/O sub-region includes I/O cells and core logic. An additional IC includes a first I/O region surrounding a core region and a second I/O region surrounding the first I/O region. The IC also includes bonding pads arranged outside of I/O cells in the first and second I/O regions. A width of the I/O cells is approximately equal to a pitch of the bonding pads.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: December 28, 2004
    Assignee: LSI Logic Corporation
    Inventors: Anwar Ali, Tauman T. Lau, Max M. Young