Patents by Inventor Max Moitzger

Max Moitzger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for encapsulating selected portions of a printed circuit board
    Patent number: 4861251
    Abstract: An apparatus for encapsulating selected portions of the printed circuit board in a pin grid array using transfer molding techniques. In one embodiment for encapsulating only the top surface and side edges of the board, a vacuum is provided in the lower cavity to hold the edges of the bottom surface of the board flush against the mold plate. In a second embodiment for encapsulating all exposed surfaces of the board, the array pins are inserted in holes in the bottom of the cavity and supported by an adjustable block which positions the board in the cavity.
    Type: Grant
    Filed: February 29, 1988
    Date of Patent: August 29, 1989
    Assignee: Diehard Engineering, Inc.
    Inventor: Max Moitzger
  • Encapsulation mold
    Patent number: 4560138
    Abstract: An encapsulation mold has slanted support walls which accommodate a plurality of units that are to be encapsulated, and a runner system for effectively distributing plastic to chamber adjacent the areas of the units that are to be encapsulated.
    Type: Grant
    Filed: November 25, 1983
    Date of Patent: December 24, 1985
    Inventors: Gaston D. de Puglia, William J. Van der Borght, Max Moitzger