Patents by Inventor Max S. Robin

Max S. Robin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5134679
    Abstract: Disclosed is a connector which permits optical connections between a circuit pack and backplane. The optical components are mounted on a major surface of a circuit pack near the edge. Optical fibers are mounted within a housing which is secured to the backplane. The use of springs within the housing gives sufficient tolerances so that the fibers are aligned with the components when the circuit pack is inserted within a shelf.
    Type: Grant
    Filed: May 20, 1991
    Date of Patent: July 28, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: Max S. Robin, David A. Snyder, Roger E. Weiss
  • Patent number: 4806107
    Abstract: Disclosed is a high frequency connector employing a plurality of columns of female contacts for receiving signal carriers and ground/power blades providing shielding between the columns of female contacts. The signal and ground/power blades are coupled to a circuit pack by means of a plurality of flexible circuit sheets. The connector provides full shielding of the signal carriers to the backplane.
    Type: Grant
    Filed: October 16, 1987
    Date of Patent: February 21, 1989
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: Richard M. Arnold, Paul A. Baker, Coleen A. Drucker, Robert J. Gashler, Dominic T. Lipari, Max S. Robin, Howard C. Schell
  • Patent number: 4571014
    Abstract: A high frequency modular connector (1) for use with a circuit board (2) to interconnect the circuit board with a backplane (3) of equipment mounting apparatus. The connector apparatus comprises connector modules (10, 12) each having a row and column configuration of first contacts (1014) for engaging the backplane with each first contact connected by a shielded conductor path (1010) with a corresponding second contact (1013) for engaging the circuit board. A conducting member (13) surrounds the first contacts and engages a spring conducting member (11) positioned between and electrically engaging the connector modules. The spring conducting member is biased in engagement with grounding apparatus of the backplane to provide a common ground for shielding the connector apparatus.
    Type: Grant
    Filed: May 2, 1984
    Date of Patent: February 18, 1986
    Assignee: AT&T Bell Laboratories
    Inventors: Max S. Robin, Peter J. Tamburro, Roger E. Weiss