Patents by Inventor Max S. Robinson

Max S. Robinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4033030
    Abstract: A keyswitch assembly including a circuit board having a plurality of circuits, each circuit terminating with a pair of first and second contacts, and a curved, resilient contact plate associated with each pair of contacts having at least a portion of its periphery in communication with one of the pair of contacts, the plate being selectively deflectable so that it communicates with the other contact to close the respective circuit. The contact plates are fixed in position by a retaining element comprising a film formed by a layer of thermoplastic material bonded to a flexible sheet of insulative material, the thermoplastic material being bonded to the resilient plates and circuit board thereby maintaining the former in correct position relative to the latter. The method of manufacturing the assembly includes precisely locating the plates over the pairs of contacts, placing the retaining element over the circuit board an applying pressure to the assembly at an elevated temperature for a predetermined time.
    Type: Grant
    Filed: March 15, 1976
    Date of Patent: July 5, 1977
    Assignee: Mohawk Data Sciences Corporation
    Inventors: Max S. Robinson, Thomas J. Studebaker
  • Patent number: 4018999
    Abstract: A keyswitch assembly including a circuit board having a plurality of circuits, each circuit terminating with a pair of first and second contacts, and a curved, resilient contact plate associated with each pair of contacts having at least a portion of its periphery in communication with one of the pair of contacts, the plate being selectively deflectable so that it communicates with the other contact to close the respective circuit. The contact plates are fixed in position by a retaining element comprising a film formed by a layer of thermoplastic material bonded to a flexible sheet of insulative material, the thermoplastic material being bonded to the resilient plates and circuit board thereby maintaining the former in correct position relative to the latter. The method of manufacturing the assembly includes precisely locating the plates over the pairs of contacts, placing the retaining element over the circuit board and applying pressure to the assembly at an elevated temperature for a predetermined time.
    Type: Grant
    Filed: September 12, 1974
    Date of Patent: April 19, 1977
    Assignee: Mohawk Data Sciences Corporation
    Inventors: Max S. Robinson, Thomas J. Studebaker