Abstract: An integrated testing and handler mechanism includes an input/output module including: an input section, an output section, a turret that includes a plurality of pickup heads, and a shuttle configured to move the carrier from the component loading location to a test module transfer location; and a test module including: a test head comprising an array of a plurality of test sockets, a plunger configured to plunge the components held by the carrier into the test sockets when the carrier is located on the plunger, and a rotary table that includes a plurality of grippers that rotate around the rotary table, the rotary table being configured to (i) transfer a carrier between the test module transfer location and an input/output module transfer location, (ii) rotate the carrier between the input/output module transfer location and a plunger transfer location, and (iii) transfer the carrier between the plunger transfer location and plunger.

Abstract: According to the present invention there is provided a method of handling devices comprising the steps of, receiving a tray on which devices to be tested are supported, into a flipping station; positioning the tray under a boat, so that the devices which are supported on the tray are sandwiched between the tray and a surface of the boat which can support devices, to form a first stack; flipping the first stack, so that the tray is positioned over the boat, to cause the devices to fall, under the influence of gravity, away from the tray to become supported on the surface of the boat, thereby transferring the devices from the tray to the surface of the boat; moving the boat to a testing station and testing the devices on the boat; receiving the boat of tested devices into the flipping station; positioning a tray over the boat, so that the devices which are supported on the surface of the boat are sandwiched between the surface of the boat and tray to form a second stack; flipping the second stack so that the bo

Abstract: According to the invention, there is provided a boat which comprises, a surface on which a plurality of electronic components can be supported, the surface having a plurality holes defined therein through which a vacuum can be passed to hold components on the surface; and a first vacuum inlet which is in fluid communication with the plurality of holes, wherein the first vacuum inlet can be fluidly connected to a first vacuum generating means so that the first vacuum generating means can provide a vacuum at the plurality of holes; a second vacuum inlet which is in fluid communication with the same plurality of holes with which the first vacuum inlet is in fluid communication with, wherein the second vacuum inlet can be fluidly connected to a second vacuum generating means so that the second vacuum generating means can provide a vacuum at the plurality of holes.

Abstract: An integrated testing and handler mechanism includes an input/output module including: an input section, an output section, a turret that includes a plurality of pickup heads, and a shuttle configured to move the carrier from the component loading location to a test module transfer location; and a test module including: a test head comprising an array of a plurality of test sockets, a plunger configured to plunge the components held by the carrier into the test sockets when the carrier is located on the plunger, and a rotary table that includes a plurality of grippers that rotate around the rotary table, the rotary table being configured to (i) transfer a carrier between the test module transfer location and an input/output module transfer location, (ii) rotate the carrier between the input/output module transfer location and a plunger transfer location, and (iii) transfer the carrier between the plunger transfer location and plunger.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

Abstract: According to the present invention there is provided a method of handling devices comprising the steps of, receiving a tray on which devices to be tested are supported, into a flipping station; positioning the tray under a boat, so that the devices which are supported on the tray are sandwiched between the tray and a surface of the boat which can support devices, to form a first stack; flipping the first stack, so that the tray is positioned over the boat, to cause the devices to fall, under the influence of gravity, away from the tray to become supported on the surface of the boat, thereby transferring the devices from the tray to the surface of the boat; moving the boat to a testing station and testing the devices on the boat; receiving the boat of tested devices into the flipping station; positioning a tray over the boat, so that the devices which are supported on the surface of the boat are sandwiched between the surface of the boat and tray to form a second stack; flipping the second stack so that the bo

Abstract: According to the invention, there is provided a boat which comprises, a surface on which a plurality of electronic components can be supported, the surface having a plurality holes defined therein through which a vacuum can be passed to hold components on the surface; and a first vacuum inlet which is in fluid communication with the plurality of holes, wherein the first vacuum inlet can be fluidly connected to a first vacuum generating means so that the first vacuum generating means can provide a vacuum at the plurality of holes; a second vacuum inlet which is in fluid communication with the same plurality of holes with which the first vacuum inlet is in fluid communication with, wherein the second vacuum inlet can be fluidly connected to a second vacuum generating means so that the second vacuum generating means can provide a vacuum at the plurality of holes.

Abstract: According to the present invention there is provided a component handling assembly ( ) suitable for facilitating loading or unloading a plurality of components onto/from a carrier, the assembly comprising, a carrier (1) which comprises a surface (3) on which a plurality of components (50) can be supported, wherein the surface (3) has a plurality of holes (5) defined therein; a vacuum generator (21) which can be arranged in fluid communication with said plurality of holes (5) in the surface (3) of the carrier (1) so that a vacuum can be applied, through said plurality of holes (5), to components (50) supported on the surface (3) of the carrier (1), to hold components (50) on the surface (3) of the carrier (5); a vacuum sensor (22) for sensing the level of vacuum applied to components (50) supported on the surface (3) of the carrier; a controller (23) for controlling the vacuum generator (21) during loading and/or unloading of component(s) onto/from the surface (3) of the carrier, based on the level of vacuum s

Abstract: An integrated testing and handler mechanism includes an input/output module including: an input section, an output section, a turret that includes a plurality of pickup heads, and a shuttle configured to move the carrier from the component loading location to a test module transfer location; and a test module including: a test head comprising an array of a plurality of test sockets, a plunger configured to plunge the components held by the carrier into the test sockets when the carrier is located on the plunger, and a rotary table that includes a plurality of grippers that rotate around the rotary table, the rotary table being configured to (i) transfer a carrier between the test module transfer location and an input/output module transfer location, (ii) rotate the carrier between the input/output module transfer location and a plunger transfer location, and (iii) transfer the carrier between the plunger transfer location and plunger.

Abstract: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

Abstract: A method for testing and calibrating electronic semiconductor components which convert sound into electrical signals acoustically irradiates the components in a sound chamber whose largest free length is less than half the wavelength of the highest frequency of the sound waves produced during the test.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

Abstract: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

Abstract: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

Abstract: A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component.

Abstract: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.