Patents by Inventor Max Wenzel

Max Wenzel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Controlled wetting in the manufacture of electronic components
    Patent number: 12289937
    Abstract: In an embodiment a method for manufacturing at least one electronic component includes providing a second surface area of the component adjacent to a first surface area, wherein the second surface area is repulsive to a first fluid to be applied, applying the first fluid without additional pressurization to the first and/or second surface area, wherein the first surface area is wetted by the first fluid and the first fluid is repelled from the second surface area and applying a second fluid to the first surface area, to the second surface area and/or to a surface area of the solidified first fluid, after solidification of the first fluid applied to the first surface area, wherein applying the second fluid includes applying a positive pressure, a plasma action and/or a compression molding, and wherein the second fluid wets the second surface area.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: April 29, 2025
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Daniel Leisen, Simon Jerebic, Max Wenzel
  • Controlled Wetting in the Manufacture of Electronic Components
    Publication number: 20220077357
    Abstract: In an embodiment a method for manufacturing at least one electronic component includes providing a second surface area of the component adjacent to a first surface area, wherein the second surface area is repulsive to a first fluid to be applied, applying the first fluid without additional pressurization to the first and/or second surface area, wherein the first surface area is wetted by the first fluid and the first fluid is repelled from the second surface area and applying a second fluid to the first surface area, to the second surface area and/or to a surface area of the solidified first fluid, after solidification of the first fluid applied to the first surface area, wherein applying the second fluid includes applying a positive pressure, a plasma action and/or a compression molding, and wherein the second fluid wets the second surface area.
    Type: Application
    Filed: February 25, 2020
    Publication date: March 10, 2022
    Inventors: Daniel Leisen, Simon Jerebic, Max Wenzel