Patents by Inventor Maxim Dan

Maxim Dan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11768791
    Abstract: A flattening portal bridge (FPB) is provided to support addressing according to a first addressing scheme and a second, alternative addressing scheme. The FPB comprises a primary side and a secondary side, the primary side connects to a first set of devices addressed according to a first addressing scheme, and the secondary side connects to a second set of devices addressed according to a second addressing scheme. The first addressing scheme uses a unique bus number within a Bus/Device/Function (BDF) address space for each device in the first set of devices, and the second bus addressing scheme uses a unique bus-device number for each device in the second set of devices.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: David J. Harriman, Reuven Rozic, Maxim Dan, Prashant Sethi, Robert E. Gough, Shanthanand Kutuva Rabindranath
  • Publication number: 20220334994
    Abstract: A flattening portal bridge (FPB) is provided to support addressing according to a first addressing scheme and a second, alternative addressing scheme. The FPB comprises a primary side and a secondary side, the primary side connects to a first set of devices addressed according to a first addressing scheme, and the secondary side connects to a second set of devices addressed according to a second addressing scheme. The first addressing scheme uses a unique bus number within a Bus/Device/Function (BDF) address space for each device in the first set of devices, and the second bus addressing scheme uses a unique bus-device number for each device in the second set of devices.
    Type: Application
    Filed: May 2, 2022
    Publication date: October 20, 2022
    Applicant: Intel Corporation
    Inventors: David J. Harriman, Reuven Rozic, Maxim Dan, Prashant Sethi, Robert E. Gough, Shanthanand Kutuva Rabindranath
  • Patent number: 11321264
    Abstract: A flattening portal bridge (FPB) is provided to support addressing according to a first addressing scheme and a second, alternative addressing scheme. The FPB comprises a primary side and a secondary side, the primary side connects to a first set of devices addressed according to a first addressing scheme, and the secondary side connects to a second set of devices addressed according to a second addressing scheme. The first addressing scheme uses a unique bus number within a Bus/Device/Function (BDF) address space for each device in the first set of devices, and the second bus addressing scheme uses a unique bus-device number for each device in the second set of devices.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: May 3, 2022
    Assignee: INTEL CORPORATION
    Inventors: David J. Harriman, Reuven Rozic, Maxim Dan, Prashant Sethi, Robert E. Gough, Shanthanand Kutuva Rabindranath
  • Publication number: 20210382839
    Abstract: Aspects of the embodiments are directed to systems, methods, and devices for controlling power management entry. A PCIe root port controller can be configured to receive, at a downstream port of the root port controller, from an upstream switch port, a first power management entry request; reject the first power management entry request; transmit a negative acknowledgement message to the upstream switch port; initiate a timer for at least 20 microseconds; during the 20 microseconds, ignore any power management entry requests received from the upstream switch port; receive, after the expiration of the 20 microseconds, a subsequent power management entry request; accept the subsequent power management entry request; and transmit an acknowledgement of the acceptance of the subsequent power management entry request to the upstream switch port.
    Type: Application
    Filed: August 25, 2021
    Publication date: December 9, 2021
    Applicant: Intel Corporation
    Inventors: Christopher Wing Hong Ngau, Hooi Kar Loo, Poh Thiam Teoh, Shashitheren Kerisnan, Maxim Dan, Chee Siang Chow
  • Patent number: 11132319
    Abstract: Aspects of the embodiments are directed to systems, methods, and devices for controlling power management entry. A PCIe root port controller can be configured to receive, at a downstream port of the root port controller, from an upstream switch port, a first power management entry request; reject the first power management entry request; transmit a negative acknowledgement message to the upstream switch port; initiate a timer for at least 20 microseconds; during the 20 microseconds, ignore any power management entry requests received from the upstream switch port; receive, after the expiration of the 20 microseconds, a subsequent power management entry request; accept the subsequent power management entry request; and transmit an acknowledgement of the acceptance of the subsequent power management entry request to the upstream switch port.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: September 28, 2021
    Assignee: Intel Corporation
    Inventors: Christopher Wing Hong Ngau, Hooi Kar Loo, Poh Thiam Teoh, Shashitheren Kerisnan, Maxim Dan, Chee Siang Chow
  • Publication number: 20210232522
    Abstract: A flattening portal bridge (FPB) is provided to support addressing according to a first addressing scheme and a second, alternative addressing scheme. The FPB comprises a primary side and a secondary side, the primary side connects to a first set of devices addressed according to a first addressing scheme, and the secondary side connects to a second set of devices addressed according to a second addressing scheme. The first addressing scheme uses a unique bus number within a Bus/Device/Function (BDF) address space for each device in the first set of devices, and the second bus addressing scheme uses a unique bus-device number for each device in the second set of devices.
    Type: Application
    Filed: December 29, 2020
    Publication date: July 29, 2021
    Applicant: Intel Corporation
    Inventors: David J. Harriman, Reuven Rozic, Maxim Dan, Prashant Sethi, Robert E. Gough, Shanthanand Kutuva Rabindranath
  • Patent number: 10884965
    Abstract: Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: January 5, 2021
    Assignee: INTEL CORPORATION
    Inventors: David J. Harriman, Maxim Dan
  • Patent number: 10877915
    Abstract: A flattening portal bridge (FPB) is provided to support addressing according to a first addressing scheme and a second, alternative addressing scheme. The FPB comprises a primary side and a secondary side, the primary side connects to a first set of devices addressed according to a first addressing scheme, and the secondary side connects to a second set of devices addressed according to a second addressing scheme. The first addressing scheme uses a unique bus number within a Bus/Device/Function (BDF) address space for each device in the first set of devices, and the second bus addressing scheme uses a unique bus-device number for each device in the second set of devices.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: December 29, 2020
    Assignee: Intel Corporation
    Inventors: David J. Harriman, Reuven Rozic, Maxim Dan, Prashant Sethi, Robert E. Gough, Shanthanand Kutuva Rabindranath
  • Publication number: 20200042482
    Abstract: Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
    Type: Application
    Filed: August 19, 2019
    Publication date: February 6, 2020
    Inventors: David J. Harriman, Maxim Dan
  • Patent number: 10387348
    Abstract: Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: August 20, 2019
    Assignee: Intel Corporation
    Inventors: David J. Harriman, Maxim Dan
  • Publication number: 20190042510
    Abstract: Aspects of the embodiments are directed to systems, methods, and devices for controlling power management entry. A PCIe root port controller can be configured to receive, at a downstream port of the root port controller, from an upstream switch port, a first power management entry request; reject the first power management entry request; transmit a negative acknowledgement message to the upstream switch port; initiate a timer for at least 20 microseconds; during the 20 microseconds, ignore any power management entry requests received from the upstream switch port; receive, after the expiration of the 20 microseconds, a subsequent power management entry request; accept the subsequent power management entry request; and transmit an acknowledgement of the acceptance of the subsequent power management entry request to the upstream switch port.
    Type: Application
    Filed: January 12, 2018
    Publication date: February 7, 2019
    Inventors: Christopher Wing Hong Ngau, Hooi Kar Loo, Poh Thiam Teoh, Shashitheren Kerisnan, Maxim Dan, Chee Siang Chow
  • Publication number: 20180357195
    Abstract: Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
    Type: Application
    Filed: April 2, 2018
    Publication date: December 13, 2018
    Inventors: David J. Harriman, Maxim Dan
  • Patent number: 9934181
    Abstract: Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: April 3, 2018
    Assignee: INTEL CORPORATION
    Inventors: David J. Harriman, Maxim Dan
  • Publication number: 20170255582
    Abstract: A flattening portal bridge (FPB) is provided to support addressing according to a first addressing scheme and a second, alternative addressing scheme. The FPB comprises a primary side and a secondary side, the primary side connects to a first set of devices addressed according to a first addressing scheme, and the secondary side connects to a second set of devices addressed according to a second addressing scheme. The first addressing scheme uses a unique bus number within a Bus/Device/Function (BDF) address space for each device in the first set of devices, and the second bus addressing scheme uses a unique bus-device number for each device in the second set of devices.
    Type: Application
    Filed: September 30, 2016
    Publication date: September 7, 2017
    Inventors: David J. Harriman, Reuven Rozic, Maxim Dan, Prashant Sethi, Robert E. Gough, Shanthanand Kutuva Rabindranath
  • Patent number: 9396151
    Abstract: Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: July 19, 2016
    Assignee: Intel Corporation
    Inventors: David J. Harriman, Maxim Dan
  • Publication number: 20160140069
    Abstract: Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
    Type: Application
    Filed: January 25, 2016
    Publication date: May 19, 2016
    Inventors: David J. Harriman, Maxim Dan
  • Publication number: 20140344500
    Abstract: Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
    Type: Application
    Filed: June 10, 2014
    Publication date: November 20, 2014
    Inventors: David J. HARRIMAN, Maxim DAN
  • Patent number: 8782321
    Abstract: Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
    Type: Grant
    Filed: February 8, 2012
    Date of Patent: July 15, 2014
    Assignee: Intel Corporation
    Inventors: David J. Harriman, Maxim Dan
  • Publication number: 20130205053
    Abstract: Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
    Type: Application
    Filed: February 8, 2012
    Publication date: August 8, 2013
    Inventors: David J. Harriman, Maxim Dan