Abstract: An IC includes a substrate including circuitry configured to provide a receiver or a transmitter circuit. A metal stack is over the semiconductor surface including a top metal layer and a plurality of lower metal layers. An isolation capacitor includes the top metal layer as a top plate that is electrically connected to a first node; and a top dielectric layer on the top plate with a top plate dielectric aperture. One of the plurality of lower metal layers provides a bottom plate that includes a plurality of spaced apart segments. A capacitor dielectric layer is between the top and bottom plate. The segments include a first segment electrically connected to a second node and at least a second segment electrically connected to a third node, with separation regions located between adjacent spaced apart segments. The top plate covers at least a portion of each of the separation regions.

Abstract: In one example, an apparatus comprises: a voltage sensing circuit having a voltage sensing terminal and a voltage sensing output, the voltage sensing circuit configured to generate a first voltage at the voltage sensing output representing a second voltage at the voltage sensing terminal; a control circuit having a control circuit input and a control circuit output, the control circuit input coupled to the voltage sensing output, the control circuit configured to: determine a state of a transistor based on the first voltage; and generate a driver signal at the control circuit output based on the state; and a driver circuit having a driver input and a switch control output, the driver input coupled to the control circuit output, the driver circuit configured to provide a current at the switch control output responsive to the driver signal.

Abstract: An IC includes a substrate including circuitry configured to provide a receiver or a transmitter circuit. A metal stack is over the semiconductor surface including a top metal layer and a plurality of lower metal layers. An isolation capacitor includes the top metal layer as a top plate that is electrically connected to a first node; and a top dielectric layer on the top plate with a top plate dielectric aperture. One of the plurality of lower metal layers provides a bottom plate that includes a plurality of spaced apart segments. A capacitor dielectric layer is between the top and bottom plate. The segments include a first segment electrically connected to a second node and at least a second segment electrically connected to a third node, with separation regions located between adjacent spaced apart segments. The top plate covers at least a portion of each of the separation regions.

Abstract: In one example, an apparatus comprises: a voltage sensing circuit having a voltage sensing terminal and a voltage sensing output, the voltage sensing circuit configured to generate a first voltage at the voltage sensing output representing a second voltage at the voltage sensing terminal; a control circuit having a control circuit input and a control circuit output, the control circuit input coupled to the voltage sensing output, the control circuit configured to: determine a state of a transistor based on the first voltage; and generate a driver signal at the control circuit output based on the state; and a driver circuit having a driver input and a switch control output, the driver input coupled to the control circuit output, the driver circuit configured to provide a current at the switch control output responsive to the driver signal.

Abstract: An IC includes a substrate including circuitry configured to provide a receiver or a transmitter circuit. A metal stack is over the semiconductor surface including a top metal layer and a plurality of lower metal layers. An isolation capacitor includes the top metal layer as a top plate that is electrically connected to a first node; and a top dielectric layer on the top plate with a top plate dielectric aperture. One of the plurality of lower metal layers provides a bottom plate that includes a plurality of spaced apart segments. A capacitor dielectric layer is between the top and bottom plate. The segments include a first segment electrically connected to a second node and at least a second segment electrically connected to a third node, with separation regions located between adjacent spaced apart segments. The top plate covers at least a portion of each of the separation regions.

Abstract: In one example, an apparatus comprises: a voltage sensing circuit having a voltage sensing terminal and a voltage sensing output, the voltage sensing circuit configured to generate a first voltage at the voltage sensing output representing a second voltage at the voltage sensing terminal; a control circuit having a control circuit input and a control circuit output, the control circuit input coupled to the voltage sensing output, the control circuit configured to: determine a state of a transistor based on the first voltage; and generate a driver signal at the control circuit output based on the state; and a driver circuit having a driver input and a switch control output, the driver input coupled to the control circuit output, the driver circuit configured to provide a current at the switch control output responsive to the driver signal.

Abstract: An IC includes a substrate including circuitry configured to provide a receiver or a transmitter circuit. A metal stack is over the semiconductor surface including a top metal layer and a plurality of lower metal layers. An isolation capacitor includes the top metal layer as a top plate that is electrically connected to a first node; and a top dielectric layer on the top plate with a top plate dielectric aperture. One of the plurality of lower metal layers provides a bottom plate that includes a plurality of spaced apart segments. A capacitor dielectric layer is between the top and bottom plate. The segments include a first segment electrically connected to a second node and at least a second segment electrically connected to a third node, with separation regions located between adjacent spaced apart segments. The top plate covers at least a portion of each of the separation regions.