Abstract: Various embodiments of the invention provide for fully-integrated, low-latency power reduction in multi-sensor systems. In certain embodiments, power consumption is minimized by modulating power and mode of operation of gyroscopes, magnetometers, and accelerometers under certain conditions. Certain embodiments provide for reduction of power consumption by the use of emulated gyroscope data.

Abstract: Various embodiments of the present invention provide for an adaptive and accurate zero cross circuit that can operate without directly sensing an inductor current. Certain embodiments allow adjustment of a zero crossing condition while eliminating the need for a blanking time. In certain embodiments this is accomplished by detecting the effects of turning off a switch on a switching node voltage of a buck converter. Some embodiments use a counter to lengthen or shorten the delay time between an inductor crossing a zero value and the effect of the switching event. In one embodiment, the effect of the switching event includes a change in the direction of the switching node voltage from which the direction of a current flowing in the buck converter inductor.

Abstract: The invention relates to a controller, and more particularly, to systems, devices and methods of controlling a sensor having a resonating mass. The controller includes: an analog-to-digital converter (ADC) unit for extracting a digitized sensor signal from the sensor signal; a phase controller for generating, based on the digitized sensor signal, a phase-controlled signal that is locked in phase with the digitized sensor signal; an amplitude controller for applying a gain to the digitized sensor signal to thereby generate an amplitude-adjusted signal; a modulator for modulating the amplitude-adjusted signal to thereby generate a modulated signal; and a phase shifter for shifting the phase of the modulated signal by 90 degrees. The output signal from the phase shifter is amplified and input to the drive for exciting the resonating mass, to thereby form a closed resonance loop for controlling the oscillation amplitude of the resonating mass.

Abstract: The invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of compensating the effect of the thermo-mechanical stress by incorporating and adjusting elastic elements that are used to couple a moveable proof mass to anchors. The proof mass responds to acceleration by displacing and tilting with respect to a moveable mass rotational axis. The thermo-mechanical stress is accumulated in the structure during the courses of manufacturing, packaging and assembly or over the structure's lifetime. The stress causes a displacement on the proof mass. A plurality of elastic elements is coupled to support the proof mass. Geometry and configuration of these elastic elements are adjusted to reduce the displacement caused by the thermo-mechanical stress.

Abstract: Various embodiments of the invention allow for low-noise, high performance input common mode voltage control in capacitive sensor front end amplifiers. In certain embodiments overcome the shortcomings of the prior art by implementing a full voltage swing common mode voltage comparator in a parallel feed-forward path to compensate large common mode input signal variations.

Abstract: The invention relates to a smartcard reader, and more particularly, to systems, devices and methods of creating a card input/output interface that allows the smartcard reader to couple to a smartcard within a secure cavity. The secure cavity is mounted on an internal side of a system housing, i.e., a smartcard socket, included in the smartcard reader. An interface chip is further attached inside the secure cavity. When the smartcard is inserted to a designated position or depth inside the system housing, the secure cavity encloses the interface chip and its contact area with the smartcard. Mechanical contacts on the interface chip are thus aligned to and physically contact electrical connectors on the inserted smartcard, so as to electrically couple the interface chip and the smartcard. As a result, sensitive data within the smartcard may be protected from exposure to any tamper attempt and processed with an enhanced security level.

Abstract: The present invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of incorporating z-axis out-of-plane stoppers that are controlled to protect the structure from both mechanical shock and electrostatic disturbance. The z-axis out-of plane stoppers include shock stoppers and balance stoppers. The shock stoppers are arranged on a cap substrate that is used to package the structure. These shock stoppers are further aligned to a proof mass in the structure to reduce the impact of the mechanical shock. The balance stoppers are placed underneath the proof mass, and electrically coupled to a balance voltage, such that electrostatic force and torque imposed by the shock stoppers is balanced by that force and torque generated by the balance stoppers. This structure is less susceptible to mechanical shock, and shows a negligible offset that may be induced by electrostatic disturbance caused by the shock stoppers.

Abstract: An electric circuit comprising means for communicating with an external device coupled to means for measuring the charge condition of an external battery. In some embodiments, the circuit comprises at least one level shifter for changing the reference voltage of communication signals. In some embodiments, the circuit comprises a first driver and a second driver for driving external switching elements for the controlled charge and discharge of the battery.

Abstract: Various embodiments of the invention achieve optimal data security by adding a security layer to data at the point of generation. Some embodiments add a security feature to data that controls or configures a device at a physical interface.

Abstract: Various embodiments of the invention provide for single and dual phase charge pump, two stage DC/DC buck-boost converters having fast line and load transient control irrespective of load conditions. In certain embodiments of the invention, this is accomplished by controlling a desired output voltage with an error amplifier that controls a plurality of hysteresis comparators. A dual phase charge pump architecture eliminates ripple currents and mode transitions and increases efficiency by splitting the total current between two paths. Certain embodiments allow to use low voltage semiconductor devices, which significantly reduces switching losses and further increases efficiency.

Abstract: A wafer-level package device and techniques are described that include utilizing a dry-etch process for mitigating metal seed layer undercut. In an implementation, a process for fabricating the wafer-level package device that employs the techniques of the present disclosure includes processing a substrate, depositing a metal seed layer on the substrate, depositing and patterning a resist layer, depositing a redistribution layer structure, removing the photoresist layer, and dry-etching the metal seed layer. In implementations, the wafer-level package device that employs example techniques in accordance with the present disclosure includes a substrate, a metal seed layer disposed on the substrate, and a redistribution layer structure formed on the metal seed layer. The metal seed layer is dry-etched so that undercut is mitigated.

Abstract: A touch panel assembly device implementing chip-on-glass technology and a method (e.g., process) for making same are described herein. The touch panel assembly includes a touch panel (e.g., a capacitive touch panel). The touch panel includes a substrate formed of insulator material (e.g., glass). The touch panel also includes a plurality of conductors (e.g., transparent conductors, indium tin oxide traces) formed on the substrate. The touch panel assembly further includes an integrated circuit (e.g., a touch chip). The integrated circuit is disposed upon the substrate and is connected (e.g.., mechanically and electrically connected) to one or more conductors included in the plurality of conductors. The integrated circuit is communicatively coupled with the touch panel.

Abstract: A device and fabrication techniques are described that employ wafer-level packaging techniques for fabricating semiconductor devices that include a pad defined contact. In implementations, the wafer-level package device that employs the techniques of the present disclosure includes a substrate, a passivation layer, a top metal contact pad, a thin film with a via formed therein, a redistribution layer structure configured to contact the top metal contact pad, and a dielectric layer on the thin film and the redistribution layer structure. In implementations, a process for fabricating the wafer-level package device that employs the techniques of the present disclosure includes processing a substrate, forming a passivation layer, depositing a top metal contact pad, forming a thin film with a via formed therein, forming a redistribution layer structure in the via formed in the thin film, and forming a dielectric layer on the thin film and the redistribution layer structure.

Abstract: The invention relates to a microelectro-mechanical structure (MEMS), and more particularly, to systems, devices and methods of compensating effect of thermo-mechanical stress on a micro-machined accelerometer by incorporating and adjusting elastic elements to couple corresponding sensing electrodes. The sensing electrodes comprise moveable electrodes and stationary electrodes that are respectively coupled on a proof mass and a substrate. At least one elastic element is incorporated into a coupling structure that couples two stationary electrodes or couples a stationary electrode to at least one anchor. More than one elastic element may be incorporated. The number, locations, configurations and geometries of the elastic elements are adjusted to compensate an output offset and a sensitivity drift that are induced by the thermo-mechanical stress accumulated in the MEMS device.

Abstract: A method for gesture determination (e.g., discerning complex gestures) via an electronic system (e.g., a gesture sensing system) including an array of optical sensors is described herein. The method includes detecting a plurality of sub-gestures (e.g., simple gestures provided by a target located proximate to the system) via the array of optical sensors. The sensors generate signals based upon the detected (e.g., received) sub-gestures and transmit the signals to a processor of the gesture sensing system. The processor processes the signals to obtain data associated with the sub-gestures and analyzes the sub-gesture data to determine if the sub-gestures collectively constitute a gesture (e.g., complex gesture). When the analyzing indicates that the sub-gestures collectively constitute a complex gesture, the gesture sensing system detects the complex gesture.

Abstract: Wafer-level package semiconductor devices for high-current applications are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to support the pillar. The wafer-level package device also includes an integrated circuit chip device (e.g., small die) configured upon the integrated circuit chip (e.g., large die). In the wafer-level package device, the height of the integrated circuit chip device is less than the height of the pillar and/or less than the combined height of the pillar and the one or more solder contacts.

Abstract: Techniques are described herein for a dip soldering process which provides a low-profile, low-cost solder bump formation process which may be implemented to promote package thickness scaling (e.g., reduce the overall package thickness). For example, the dip soldering process disclosed herein may enable ultra-thin wafer-level packages (WLP), ultra-thin wafer level quad-flat no-leads (WQFN) packages, or the like.

Abstract: A digital-to-analog converter (DAC) includes, in a segment of the DAC, a first switch and a second switch. The first switch includes a first pair of transistors having a first set of inputs and has a first output connected to an output of the DAC. The second switch includes second and third pairs of transistors having second and third sets of inputs, respectively, and has a second output that is connected to the output of the DAC. A driver module generates control signals to drive the first, second, and third sets of inputs based on data received by the DAC for conversion from digital to analog format at a conversion rate determined by a clock. The control signals toggle one of the first and second switches during each cycle of the clock.

Abstract: Aspects of the disclosure pertain to a system and method for providing temperature limiting for a voice coil of a speaker. The system and method provide the aforementioned temperature limiting based upon monitoring (e.g., measurement) of an amplifier output signal provided to the speaker. Providing the aforementioned temperature limiting promotes improved protection for the speaker.

Abstract: Various embodiments of the invention allow for electronic labeling and identification of electronic equipment. Contact-based and contactless systems and methods to electronically associate hardware are described.