Abstract: The present disclosure provides an apparatus for characterizing mechanical properties of a sample. The apparatus comprises a structure for supporting the sample and applying a first pressure in a first direction to the sample and an actuator for modulating the first pressure. The apparatus also comprises a pressure applicator containing a liquid and arranged to apply a second pressure to the sample in a second direction that is transversal to the first direction. Further, the apparatus comprises a pore pressure applicator arranged to apply a flow of a fluid through a porous sample such that a pore pressure is applied to the porous sample. In addition, the apparatus comprises a sensor for sensing a change in the sample in response to a change in a pressure experienced by the sample.

Abstract: A method for determining the density of cement slurry in undersea drilling is disclosed. The method uses the reflection of acoustic waves from the slurry in order to determine its acoustic impedance and thus its density.

Abstract: The present disclosure provides an apparatus for characterising mechanical properties of a sample. The apparatus comprises a structure for supporting the sample and applying a first pressure in a first direction to the sample and an actuator for modulating the first pressure. The apparatus also comprises a pressure applicator containing a liquid and arranged to apply a second pressure to the sample in a second direction that is transversal to the first direction. Further, the apparatus comprises a pore pressure applicator arranged to apply a flow of a fluid through a porous sample such that a pore pressure is applied to the porous sample. In addition, the apparatus comprises a sensor for sensing a change in the sample in response to a change in a pressure experienced by the sample.

Abstract: A method for determining the density of cement slurry in undersea drilling is disclosed. The method uses the reflection of acoustic waves from the slurry in order to determine its acoustic impedance and thus its density.

Abstract: A method for forming an ultrafine particle brittle material at low temperature which includes the steps of applying a mechanical impact force or a pressure to a ultrafine particle brittle material so as to have a percentage in the ultrafine particles having a primary particle diameter less than 50 nm in all the particles of 10 to 90%, subjecting the resulting brittle material to a heat treatment at a temperature not higher than the sintering temperature thereof so as to have the above percentage of 50% or less, and then applying a mechanical impact force not less than the crushing strength to the resultant material, to crush the material, thereby joining the ultrafine particles in the brittle material with one another, to form a formed article of the ultrafine particle brittle material; and an ultrafine particle brittle material for use in the method.

Abstract: A circuit substrate includes a passive element and an interconnection pattern, wherein any of the passive element and the interconnection pattern is formed by an aerosol deposition process that uses aerosol of a fine particle material.

Abstract: A method for forming an ultrafine particle brittle material at low temperature which includes the steps of applying a mechanical impact force or a pressure to a ultrafine particle brittle material so as to have a percentage in the ultrafine particles having a primary particle diameter less than 50 nm in all the particles of 10 to 90%, subjecting the resulting brittle material to a heat treatment at a temperature not higher than the sintering temperature thereof so as to have the above percentage of 50% or less, and then applying a mechanical impact force not less than the crushing strength to the resultant material, to crush the material, thereby joining the ultrafine particles in the brittle material with one another, to form a formed article of the ultrafine particle brittle material; and an ultrafine particle brittle material for use in the method.

Abstract: A method for forming an ultrafine particle brittle material at low temperature which includes the steps of applying a mechanical impact force or a pressure to a ultrafine particle brittle material so as to have a percentage in the ultrafine particles having a primary particle diameter less than 50 nm in all the particles of 10 to 90%, subjecting the resulting brittle material to a heat treatment at a temperature not higher than the sintering temperature thereof so as to have the above percentage of 50% or less, and then applying a mechanical impact force not less than the crushing strength to the resultant material, to crush the material, thereby joining the ultrafine particles in the brittle material with one another, to form a formed article of the ultrafine particle brittle material; and an ultrafine particle brittle material for use in the method.

Abstract: A method for forming an ultrafine particle brittle material at low temperature which comprisis the steps of applying a mechanical impact force or a pressure to a ultrafine particle brittle material so as to have a percentage in the ultrafine particles having a primary particle diameter less than 50 nm in all the particles of 10 to 90%, subjecting the resulting brittle material to a heat tratment at a temperature not higher than the sintering temperature thereof so as to have the above percentage of 50% or less, and then applying a mechanical impact force not less than the crushing strength to the resultant material, to crush the material, thereby joining the ultrafine particles in the brittle material with one another, to form a formed article of the ultrafine particle brittle material; and an ultrafine particle brittle material for use in the method.

Abstract: A circuit substrate includes a passive element and an interconnection pattern, wherein any of the passive element and the interconnection pattern is formed by an aerosol deposition process that uses aerosol of a fine particle material.