Patents by Inventor Maxime Cadotte

Maxime Cadotte has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser ashing of polyimide for semiconductor manufacturing
    Patent number: 9865564
    Abstract: A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: January 9, 2018
    Assignee: GLOBALFOUNDRIES INC
    Inventors: Maxime Cadotte, Luc Guerin, Van Thanh Truong, Steve Whitehead
  • LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
    Publication number: 20150162300
    Abstract: A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.
    Type: Application
    Filed: February 18, 2015
    Publication date: June 11, 2015
    Inventors: Maxime Cadotte, Luc Guerin, Van Thanh Truong, Steve Whitehead
  • Laser ashing of polyimide for semiconductor manufacturing
    Patent number: 8999107
    Abstract: A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: April 7, 2015
    Assignee: International Business Machines Corporation
    Inventors: Maxime Cadotte, Luc Guerin, Van Thanh Truong, Steve Whitehead
  • Underfill adhesion measurements at a microscopic scale
    Patent number: 8796049
    Abstract: Methods and systems to method to determine an adhesion force of an underfill material to a chip assembled in a flip-chip module are provided. A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate. The method also includes forming a block from the layer of underfill material. The method further includes measuring a force required to shear the block from a surface of the flip-chip module.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: August 5, 2014
    Assignee: International Business Machines Corporation
    Inventors: Maxime Cadotte, Marie-Claude Paquet, Julien Sylvestre
  • UNDERFILL ADHESION MEASUREMENTS AT A MICROSCOPIC SCALE
    Publication number: 20140030827
    Abstract: Methods and systems to method to determine an adhesion force of an underfill material to a chip assembled in a flip-chip module are provided. A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate. The method also includes forming a block from the layer of underfill material. The method further includes measuring a force required to shear the block from a surface of the flip-chip module.
    Type: Application
    Filed: July 30, 2012
    Publication date: January 30, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Maxime CADOTTE, Marie-Claude PAQUET, Julien SYLVESTRE
  • LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
    Publication number: 20120111496
    Abstract: A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.
    Type: Application
    Filed: October 31, 2011
    Publication date: May 10, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Maxime Cadotte, Luc Guerin, Van Thanh Truong, Steve Whitehead