Abstract: The invention concerns a removable composition formed by at least: a polyamide or a copolyamide or a mixture of polyamides or a mixture of copolyamides or a mixture of at least one polyamide and at least one copolyamide, the polyamide(s) and copolyamide(s) being soluble in alcohol, and an expansion agent, the maximum expansion temperature of which is greater than the melting point of the polyamide or the copolyamide or of the mixture. The invention also relates to assemblies comprising such a composition, the use thereof and a method for detaching the composition.

Abstract: Use of a thermoplastic material for blocking an optical substrate (100) in a machining position, wherein the thermoplastic material is formulated from a composition comprising a shellac and a plasticizer where the shellac and the plasticizer are chosen so as to have the softening point of the thermoplastic material greater than or equal to 60° C. and smaller than or equal to 85° C.

Abstract: An assembly (20) includes a first substrate (10) and a second substrate (12) bonded by at least one joint (14), characterized in that the joint (14) is made of a polymer material with a Young modulus tensile value at 25° C. of 500 MPa to 5 GPa, and includes at least one migrating agent suitable for migrating up to at least two interfaces of the joint (14) in order to generate interfacial detachment. A composition suitable for bonding the assembly, a method for assembling the assembly by bonding and a method for dismantling the bonded assembly via migration and creation of an interfacial detachment by heating the body thereof are also described.

Abstract: An assembly (20) includes a first substrate (10) and a second substrate (12) bonded by at least one joint (14), characterized in that the joint (14) is made of a polymer material with a Young's tensile modulus value at 25° C. of between 0.1 and 500 MPa, and includes at least one migrating agent suitable for migrating up to at least one of the interfaces of the joint (14) in order to generate interfacial detachment. A composition enabling the bonding of the assembly, a method for mounting the assembly by bonding, and a method for dismantling the bonded assembly by way of migration and creation of an interfacial detachment by localized heating are also described.

Abstract: A method for detachably gluing at least one porous substrate to another material using at least one layer of a detachable adhesive comprising an ungluing admixture adapted for generating gases which, by gas expansion or gas migration towards at least one of the interfaces of the detachable adhesive layer, weakens the adhesive bond when heated by a detaching control, the aforementioned method including, before gluing, applying a metal sealing coating onto at least one of the substrates.

Abstract: Use of a thermoplastic material for blocking an optical substrate (100) in a machining position, wherein the thermoplastic material is formulated from a composition comprising a shellac and a plasticizer where the shellac and the plasticizer are chosen so as to have the softening point of the thermoplastic material greater than or equal to 60° C. and smaller than or equal to 85° C.

Abstract: A composition designed for the detachable assembly of a first substrate and a second substrate by gluing, includes an adhesive polymer base and at least one active substance. The active substance is encapsulated in a wax matrix so as to prevent any reaction with the adhesive polymer material during the storage of the composition or during its implementation. A process for preparing this composition is also described.