Patents by Inventor Maxime Pailhes

Maxime Pailhes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC PACKAGE WITH THERMAL VIAS, AND FABRICATION PROCESS
    Publication number: 20130016478
    Abstract: An electronic package includes at least one heat-transfer element interposed between a front side of an integrated-circuit chip and a back side of a heat-transfer plate. An encapsulation block has a portion lying between the front side of the integrated-circuit chip and the back side of the heat-transfer plate. The portion embeds the heat-transfer element. Another heat transfer element is interposed between a front side of a electrical-connection support plate and a rim portion of the heat-transfer plate.
    Type: Application
    Filed: July 13, 2012
    Publication date: January 17, 2013
    Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventors: Jean Gagnieux, Maxime Pailhes