Abstract: A transmission unit for a LIDAR device for emitting collimated beams into a scanning area. The transmission unit includes at least one beam source for generating beams in the form of a beam bundle, the beam source being designed as a surface emitter or an emitter array, and a transmission optical unit including at least one lens. The transmission unit includes a diaphragm including at least one aperture, which is configured to delimit a cross section of the beam bundle of the generated beams in a horizontal direction and/or a vertical direction. The at least one lens of the transmission optical unit is situated downstream from the diaphragm in the emission direction of the beams. A LIDAR device is also described.

Abstract: A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

Abstract: A laser diode device includes a thermally conductive substrate that has a planar surface for dissipating ambient heat, and a plurality of laser diodes situated thereon, each of which includes at least one epitaxial layer that is situated on a side of the laser diode facing the substrate. The laser diodes are each electrically activated via an electrically conductive coating situated between the at least one epitaxial layer and the substrate. The substrate includes a plurality of metallized cavities that accommodate the plurality of laser diodes so that the plurality of laser diodes have an essentially uniform height above the substrate.

Abstract: A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

Abstract: A device for coupling electromagnetic waves into a chip or the like, including a cavity for accommodating a light source, an opening for the passage of light of the light source, which is connected to the cavity, the device including a first surface and a second surface situated opposite the first surface, at least one of the two surfaces including at least two first surface sections, which are inclined relative to one another at an inclination angle, and the distance between the first surface and the second surface being different on different sides of the cavity and/or of the opening, and surface areas on different sides of the cavity and/or opening respectively adjacent thereto having the identical inclination angle.

Abstract: A laser diode device includes a thermally conductive substrate that has a planar surface for dissipating ambient heat, and a plurality of laser diodes situated thereon, each of which includes at least one epitaxial layer that is situated on a side of the laser diode facing the substrate. The laser diodes are each electrically activated via an electrically conductive coating situated between the at least one epitaxial layer and the substrate. The substrate includes a plurality of metallized cavities that accommodate the plurality of laser diodes so that the plurality of laser diodes have an essentially uniform height above the substrate.

Abstract: A device for coupling electromagnetic waves into a chip or the like, including a cavity for accommodating a light source, an opening for the passage of light of the light source, which is connected to the cavity, the device including a first surface and a second surface situated opposite the first surface, at least one of the two surfaces including at least two first surface sections, which are inclined relative to one another at an inclination angle, and the distance between the first surface and the second surface being different on different sides of the cavity and/or of the opening, and surface areas on different sides of the cavity and/or opening respectively adjacent thereto having the identical inclination angle.

Abstract: A microelectronic component arrangement includes a sensor and a carrier. The sensor has a detection surface and a region including contact elements situated at a first distance with respect to one another. The carrier includes a mounting surface, and the sensor is fixed on the carrier by the contact elements situated at a first distance with respect to one another at least regionally. The detection surface is opposite the mounting surface in a manner having a second distance with respect to the mounting surface. The contact elements are wetted by a mechanically stabilizing material, the region including the contact elements is enclosed by the mechanically stabilizing material, and the detection surface is free of the mechanically stabilizing material.

Abstract: A microelectronic component arrangement includes a sensor and a carrier. The sensor has a detection surface and a region including contact elements situated at a first distance with respect to one another. The carrier includes a mounting surface, and the sensor is fixed on the carrier by the contact elements situated at a first distance with respect to one another at least regionally. The detection surface is opposite the mounting surface in a manner having a second distance with respect to the mounting surface. The contact elements are wetted by a mechanically stabilizing material, the region including the contact elements is enclosed by the mechanically stabilizing material, and the detection surface is free of the mechanically stabilizing material.