Abstract: The present disclosure relates to micron-sized particle used for catalyzing and storing NOx gases, such as those found in vehicle exhaust emissions, washcoats employing micron-sized particle used for catalyzing and storing NOx gases, washcoat coated substrates, lean NOx trap (LNT) systems, and vehicles using such systems. Also provided are methods of preparing micron-sized particle used for catalyzing and storing NOx gases, as well as preparation of washcoats and coated substrates. More specifically, the present disclosure relates to a lean NOx trapping materials, wherein the materials include a NOx catalytic component attached to a micron-sized carrier particle and a NOx storage component, as well as washcoats and coated substrates useful in the treatment of exhaust gases. In some embodiments, a portion of the NOx storage component is attached to the micron-sized carrier particle.

Abstract: Disclosed are washcoats, coated substrates formed from such washcoats, and catalytic converters for use in diesel applications, such as heavy duty diesel applications. Methods of preparing the coated substrates are also disclosed.

Abstract: An automatic system for monitoring chemistry information for a body of water comprises a sensor for determining chemistry information, a microprocessor for processing chemistry information, and a housing coupled to at least one of the sensor and the microprocessor. Preferably the housing is floatable or mountable. The method of providing chemistry information of a body of water comprising the steps of obtaining a sample of the body of water and determining chemistry information.

Abstract: The system includes a metrology module coupled to a supercritical processing chamber, and the method includes positioning a substrate on a substrate holder in a metrology chamber, measuring a residue in at least one feature of the substrate, determining a supercritical cleaning process recipe based on the measured residue, positioning the substrate on a substrate holder in a supercritical processing chamber coupled to the metrology chamber, cleaning the substrate with a supercritical fluid using the determined supercritical cleaning process recipe, and removing the substrate from the supercritical processing chamber. The method may further include re-positioning the substrate in the metrology chamber, and measuring any remaining residue in at least one feature of the substrate.

Abstract: An electronic system for use in a body of fluid is disclosed. The electronic system includes a first housing element and a second housing element. The second housing element is hermetically sealed to the first housing element, forming a first chamber there between. An electronic circuit is mounted within the first chamber. The electronic system further includes a second chamber internal to the second housing element. The second chamber is configured for holding a power source for the electronic circuit. Preferably, the power source is a battery pack. Also, the electronic system includes means for temporarily sealing the second chamber. Preferably, means for temporarily sealing the second chamber includes a detachable plug configured for coupling to the second housing element.

Abstract: An automatic system for monitoring chemistry information for a body of water comprises a sensor for determining chemistry information, a microprocessor for processing chemistry information, and a housing coupled to at least one of the sensor and the microprocessor. Preferably the housing is floatable or mountable. The method of providing chemistry information of a body of water comprising the steps of obtaining a sample of the body of water and determining chemistry information.

Abstract: A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical drive mechanism couples the platen to the chamber housing. In operation, the mechanical drive mechanism separates the platen from the chamber housing for loading of the semiconductor substrate. In further operation, the mechanical drive mechanism causes the second sealing surface of the platen and the first sealing surface of the chamber housing to form a high pressure processing chamber around the semiconductor substrate.

Abstract: A method and apparatus are provided which increase the collimation of sputter deposited films by increasing the mean free path (MFP) of sputtered atoms so as to reduce redirecting collisions with the buffer gas. This is accomplished by reducing buffer gas pressure while employing mechanisms to maintain or increase plasma electron density so as to sustain the plasma in the absence of normally required gas pressure. A first mechanism used to permit reduced gas pressure is to provide gas flow directly to the immediate region of the plasma discharge rather than to another remote area of the sputter deposition chamber. A second mechanism used to permit reduced gas pressure is to provide an electron emitting source near the plasma discharge to increase the plasma electron density without requiring further ionization of buffer gas atoms. These two mechanisms can be used either alone or together, as desired, in view of the circumstances presented.