Abstract: An apparatus automatically packages wafer cassettes in a shipping box. The apparatus includes: a loading station configured to take the shipping box for semiconductor wafers; a radio-frequency identification (RFID) reader/writer configured to read and write to an RFID tag affixed to the shipping box; a camera configured to optically examine attachments to the shipping box; an element configured for equipping the shipping box with a desiccant pouch; an element configured for sealing a bag that surrounds the shipping box with a weld seam; an element configured for checking the impermeability of a weld seam; an element configured for applying labels to the shipping box; a robot arm configured to automatically transport the shipping box; an element configured for storing packaging material; and an element configured to take the shipping box for semiconductor wafers and to store the shipping box for transportation.