Patents by Inventor Maximilian Hodl

Maximilian Hodl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit boards of laminated thermosetting sheets
    Patent number: 4604314
    Abstract: Improved printed circuit boards of laminated thermosetting sheets with epoxy resin as the bonding agent contain for inhibiting copper migration 0.1% to 10% N,N'-bis-salicyloyl hydrazine, based on the weight of the hardened epoxy resin.
    Type: Grant
    Filed: January 25, 1985
    Date of Patent: August 5, 1986
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang von Gentzkow, Maximilian Hodl, Wolfgang Kleeberg, Helmut Markert