Abstract: Systems and methods for fabricating ring structures are disclosed. In one embodiment, a method of forming a ring structure includes forming an inner contour and an outer contour including a plurality of perforations by directing a pulsed laser beam focal line into a substrate at a plurality of locations, the pulsed laser beam focal line generating an induced absorption within a substrate at each of the locations, the induced absorption producing one of the plurality of perforations. The method further includes heating the outer contour with a heating laser beam such that an article separates from the substrate at the outer contour, heating a region of the article between an outer edge of the article and the inner contour with the heating laser beam, and removing an inner portion of the article at the inner contour to form the ring structure.

Abstract: In one embodiment, a method of drilling a feature in a substrate includes directing a pulsed laser beam focal line into the substrate at a plurality of locations, the laser beam focal line generating an induced absorption within the substrate such that the laser beam focal line produces a perforation extending through a thickness of the substrate at the plurality of locations to form a perforation contour. The method further includes directing a focused ablation laser beam into the substrate and ablating at least a portion of the substrate along an ablation track that is offset from the perforation contour by a perforation-ablation offset ?nP-Ablation to remove substrate material within a shape defined by the perforation contour to form the feature. The perforation-ablation offset ?nP-Ablation is such that the feature has a chipping with chips having a size of less than 50 ?m.