Patents by Inventor Maximilian Kaeser

Maximilian Kaeser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for slicing a multiplicity of wafers from a crystal composed of semiconductor material
    Patent number: 8844511
    Abstract: A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: September 30, 2014
    Assignee: Siltronic AG
    Inventors: Maximilian Kaeser, Albert Blank
  • METHOD FOR SLICING A MULTIPLICITY OF WAFERS FROM A CRYSTAL COMPOSED OF SEMICONDUCTOR MATERIAL
    Publication number: 20110192388
    Abstract: A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal.
    Type: Application
    Filed: January 20, 2011
    Publication date: August 11, 2011
    Applicant: SILTRONIC AG
    Inventors: Maximilian Kaeser, Albert Blank
  • Sawing wire and method for the cutting and lapping of hard brittle workpieces
    Patent number: 6554686
    Abstract: A sawing wire is for the simultaneous cutting and lapping of a multiplicity of wafers from a hard brittle workpiece. The sawing wire exhibits torsion. There is also a method for cutting and lapping using the sawing wire.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: April 29, 2003
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Maximilian Kaeser, Christian Andrae
  • Method for cutting wafers from a crystal
    Patent number: 5947102
    Abstract: A sawing suspension composition is composed of an essentially nonaqueous or anhydrous organic liquid in which hard-material particles are dispersed. The liquid is selected from a group of compounds which comprises low molecular weight polyglycols and any desired mixture of these polyglycols. The sawing suspension is used in conjunction with a wire saw for cutting wafers from a crystal of a brittle and hard material.
    Type: Grant
    Filed: August 12, 1997
    Date of Patent: September 7, 1999
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Vernon Knepprath, Walter Frank, Maximilian Kaeser, Albert Pemwieser