Abstract: A power semiconductor module, as well as a corresponding method of manufacture, are provided. The power semiconductor module has a plurality of power switches. A first subset of the power switches forms part of a first electrical current branch. A second subset of the power switches forms part of a second electrical current branch. Within the current branches, the associated power switches are arranged symmetrically with respect to the DC voltage contacts and are connected in such a way that a current density which is formed in the individual current paths which are respectively assigned to one of the power switches is at least substantially homogeneously distributed during the high frequency operation of the power semiconductor module and/or in the operation of the power switches with high voltage gradients.

Abstract: A power semiconductor module, as well as a corresponding method of manufacture, are provided. The power semiconductor module has a plurality of power switches. A first subset of the power switches forms part of a first electrical current branch. A second subset of the power switches forms part of a second electrical current branch. Within the current branches, the associated power switches are arranged symmetrically with respect to the DC voltage contacts and are connected in such a way that a current density which is formed in the individual current paths which are respectively assigned to one of the power switches is at least substantially homogeneously distributed during the high frequency operation of the power semiconductor module and/or in the operation of the power switches with high voltage gradients.

Abstract: The invention relates to elastic expanded polymer foams and also a process for producing expanded polymer foams by sintering a mixture comprising foam particles P1 and P2 composed of different thermoplastic polymers or polymer blends, wherein the foam particles P1 are obtained by prefoaming expandable, thermoplastic polymer particles comprising A) from 45 to 97.9 percent by weight of a styrene polymer, B1) from 1 to 45 percent by weight of a polyolefin having a melting point in the range from 105 to 140° C., B2) from 0 to 25 percent by weight of a polyolefin having a melting point below 105° C., C1) from 0.1 to 25 percent by weight of a styrene-butadiene or styrene-isoprene block copolymer, C2) from 0.0 to 10 percent by weight of a styrene-ethylene-butylene block copolymer, D) from 1 to 15 percent by weight of a blowing agent, E) from 0 to 5 percent by weight of a nucleating agent, where the sum of A) to E) is 100% by weight.