Patents by Inventor Maxwell McNally
Maxwell McNally has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11885866Abstract: Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.Type: GrantFiled: May 31, 2022Date of Patent: January 30, 2024Assignee: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Loïc André Messier, Simon E. Rock, Maxwell McNally, Alexander Latham, Andreas P. Friedrich
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Publication number: 20240027560Abstract: Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.Type: ApplicationFiled: October 4, 2023Publication date: January 25, 2024Applicant: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Loïc André Messier, Simon E. Rock, Maxwell McNally, Alexander Latham, Andreas P. Friedrich
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Publication number: 20240004016Abstract: Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.Type: ApplicationFiled: May 31, 2022Publication date: January 4, 2024Applicant: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Loïc André Messier, Simon E. Rock, Maxwell McNally, Alexander Latham, Andreas P. Friedrich
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Publication number: 20240003995Abstract: A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.Type: ApplicationFiled: July 1, 2022Publication date: January 4, 2024Applicant: Allegro MicroSystems, LLCInventors: Simon E. Rock, Georges El Bacha, Shaun D. Milano, Loïc André Messier, Alexander Latham, Maxwell McNally, Shixi Louis Liu
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Publication number: 20230314483Abstract: A current sensor IC includes a unitary lead frame having a primary conductor with a first thickness and a secondary lead having a second thickness less than the first thickness. A semiconductor die adjacent to the primary conductor includes a magnetic field sensing circuit to sense a magnetic field associated with the current and generate a secondary signal indicative of the current. An insulation structure is disposed between the primary conductor and the die. A mold material encloses a first portion of the secondary lead and a second portion of the secondary lead that is exposed outside of the package has the second thickness.Type: ApplicationFiled: March 30, 2022Publication date: October 5, 2023Applicant: Allegro MicroSystems, LLCInventors: Shixi Louis Liu, Maxwell McNally, Alexander Latham
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Patent number: 11768230Abstract: A current sensor IC includes a unitary lead frame having a primary conductor with a first thickness and a secondary lead having a second thickness less than the first thickness. A semiconductor die adjacent to the primary conductor includes a magnetic field sensing circuit to sense a magnetic field associated with the current and generate a secondary signal indicative of the current. An insulation structure is disposed between the primary conductor and the die. A mold material encloses a first portion of the secondary lead and a second portion of the secondary lead that is exposed outside of the package has the second thickness.Type: GrantFiled: March 30, 2022Date of Patent: September 26, 2023Assignee: Allegro MicroSystems, LLCInventors: Shixi Louis Liu, Maxwell McNally, Alexander Latham
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Patent number: 11567890Abstract: In one aspect, an electronic device includes a switching circuit connected to a resistance circuit and ground, the resistance circuit connected to a port and the port configured to be connected in series to an external resistor and a supply voltage. A voltage at the port is a first voltage that is less than the supply voltage if the switching circuit is enabled to be a closed circuit and the voltage at the port is a second voltage that is equal to the supply voltage if the switching circuit is enabled to be an open circuit.Type: GrantFiled: June 26, 2019Date of Patent: January 31, 2023Assignee: Allegro MicroSystems, LLCInventors: Wade Bussing, Maxwell McNally
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Patent number: 11402409Abstract: Methods and apparatus for measuring a current difference between at least two primary current paths in a current sensor integrated circuit package. Each primary current path generated a magnetic field which may then be measured by at least one magnetic field sensing element positioned on an integrated circuit die. An output disconnect signal may be provided from the current sensor integrated circuit package when a current difference above a predetermined threshold exists in the two or more current traces.Type: GrantFiled: March 22, 2021Date of Patent: August 2, 2022Assignee: Allegro MicroSystems, LLCInventors: Maxwell McNally, Kevin Buckley, Alexander Latham
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Patent number: 11366141Abstract: A current sensor includes a lead frame having a plurality of leads, at least two of which form a current conductor configured to carry a current that generates a magnetic field and a substrate having first and second opposing surfaces, the first surface proximate to said current conductor and the second surface distal from the current conductor. A first magnetic field transducer is disposed on the substrate and a first coil is disposed on the substrate adjacent to the first magnetic field transducer, wherein the first magnetic field transducer and the first coil are positioned on a first side of the current conductor. A second magnetic field transducer is disposed on the substrate and a second coil is disposed on the substrate adjacent to the second magnetic field transducer, wherein the second magnetic field transducer and the second coil are positioned on a second side of the current conductor.Type: GrantFiled: January 28, 2021Date of Patent: June 21, 2022Assignee: Allegro MicroSystems, LLCInventors: Steven Daubert, Sina Haji Alizad, Srujan Shivanakere, Maxwell McNally, Alexander Latham
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Publication number: 20200409886Abstract: In one aspect, an electronic device includes a switching circuit connected to a resistance circuit and ground, the resistance circuit connected to a port and the port configured to be connected in series to an external resistor and a supply voltage. A voltage at the port is a first voltage that is less than the supply voltage if the switching circuit is enabled to be a closed circuit and the voltage at the port is a second voltage that is equal to the supply voltage if the switching circuit is enabled to be an open circuit.Type: ApplicationFiled: June 26, 2019Publication date: December 31, 2020Applicant: Allegro MicroSystems, LLCInventors: Wade Bussing, Maxwell McNally