Patents by Inventor May Chen

May Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140297519
    Abstract: A method and system for resolving disputes between parties involved in a network-based transaction is described. One aspect of the present invention seeks to automatically facilitate the restitution of value to parties of the transaction, for example, facilitated by a network-based commerce platform or involving a network-based payment service, where a dispute has arisen with respect to the transaction.
    Type: Application
    Filed: January 6, 2014
    Publication date: October 2, 2014
    Applicant: eBay Inc.
    Inventors: Huey Lin, Max R. Levchin, Gina Han, Ted Levan, Daniele Levy, Chris McGraw, Erik Klein, Greg Cervelli, Steven Wo, Carl Freeland, May Chen, Kristen Wilson, Jason Nielson, Kyle Haffey, Julie Gonzales, Denise Aptekar
  • Patent number: 8626651
    Abstract: A method and system for resolving disputes between parties involved in a network-based transaction is described. One aspect of the present invention seeks to automatically facilitate the restitution of value to parties of the transaction, for example, facilitated by a network-based commerce platform or involving a network-based payment service, where a dispute has arisen with respect to the transaction.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: January 7, 2014
    Assignee: eBay Inc.
    Inventors: Huey Lin, Max Levchin, Gina Han, Theodore Douglas Levan, Dan Levy, Chris McGraw, Erik Klein, Greg Cervelli, Steven Wo, Carl Freeland, May Chen, Kristen Wilson, Jason Nielson, Kyle Haffey, Julie Gonzales, Denise Aptekar
  • Patent number: 7870066
    Abstract: A method and system for resolving disputes between parties involved in a network-based transaction is described. One aspect of the present invention seeks to automatically facilitate the restitution of value to parties of the transaction, for example, facilitated by a network-based commerce platform or involving a network-based payment service, where a dispute has arisen with respect to the transaction.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: January 11, 2011
    Assignee: eBay Inc.
    Inventors: Huey Lin, Max Levchin, Gina Han, Theodore Douglas LeVan, Dan Levy, Chris McGraw, Erik Klein, Greg Cervelli, Steven Wo, Carl Freeland, May Chen, Kristen Wilson, Jason Nielsen, Kyle Haffey, Julie Gonzales, Denise Aptekar
  • Publication number: 20100100483
    Abstract: A method and system for resolving disputes between parties involved in a network-based transaction is described. One aspect of the present invention seeks to automatically facilitate the restitution of value to parties of the transaction, for example, facilitated by a network-based commerce platform or involving a network-based payment service, where a dispute has arisen with respect to the transaction.
    Type: Application
    Filed: December 15, 2009
    Publication date: April 22, 2010
    Inventors: Huey Lin, Max Levchin, Gina Han, Theodore Douglas Levin, Dan Levy, Chris McGraw, Erik Klein, Greg Cervelli, Steven Wo, Carl Freeland, May Chen, Kristen Wilson, Jason Nielson, Kyle Haffey, Julie Gonzales, Denise Aptekar
  • Publication number: 20070090284
    Abstract: An image sensor package structure includes a substrate having an upper surface, which is formed with equal amount of the first electrodes arranged at the each side of the upper surface, each the first electrode of the adjacent side of the substrate is corresponding electrically connected each other, so that the signal from one side of the substrate may be transmitted the adjacent side, the each side of the lower surface of the substrate is formed with second electrodes, each side of the second electrodes is less than the each side of the first electrodes of the upper surface, then the second electrode is electrically connected to the first electrode, so that the signal from the first electrode may be directly transmitted to the second electrode and through adjacent one side of the first electrode transmitted to the second electrode. A frame layer is arranged at the upper surface of the substrate.
    Type: Application
    Filed: October 20, 2005
    Publication date: April 26, 2007
    Inventors: Mon Ho, Chen Peng, May Chen, Eric Lin
  • Publication number: 20050125340
    Abstract: A method and system for resolving disputes between parties involved in a network-based transaction is described. One aspect of the present invention seeks to automatically facilitate the restitution of value to parties of the transaction, for example, facilitated by a network-based commerce platform or involving a network-based payment service, where a dispute has arisen with respect to the transaction.
    Type: Application
    Filed: April 30, 2004
    Publication date: June 9, 2005
    Inventors: Huey Lin, Max Levchin, Gina Han, Theodore LeVan, Dan Levy, Chris McGraw, Erik Klein, Greg Cervelli, Steven Wo, Carl Freeland, May Chen, Kristen Wilson, Jason Nielsen, Kyle Haffey, Julie Gonzales, Denise Aptekar
  • Patent number: 6642554
    Abstract: A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: November 4, 2003
    Assignee: Kingpak Technology, Inc.
    Inventors: Nai Hua Yeh, Chen Pin Peng, Chief Lin, C. S. Cheng, Kuang Yu Fan, Ren Long Kau, Fu Yung Huang, Yves Huang, Wu Hsiang Lee, Chih Hsien Chung, May Chen
  • Publication number: 20030094628
    Abstract: A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.
    Type: Application
    Filed: November 21, 2001
    Publication date: May 22, 2003
    Inventors: Nai Hua Yeh, Chen Pin Peng, Chief Lin, C.S. Cheng, Kuang Yu Fan, Ren Long Kau, Fu Yung Huang, Yves Huang, Wu Hsiang Lee, Chih Hsien Chung, May Chen
  • Patent number: 5709568
    Abstract: A memory card connector assembly (32) includes a connection device (40) for use with a memory card connector apparatus (34) for electrically connecting the memory card connector apparatus (34) to a mother board (33) on which such memory card connector apparatus (34) is mounted. The connection device (40) includes a daughter board (42) and a card edge connector (44) wherein the daughter board (42) is vertically positioned on the back side of the memory card connector apparatus (34) for receiving multiple rows of plural spaced contact tails (46) of the memory card connectors (36, 38). The bottom edge region (50) of the daughter board (42) having conductive pads (52) thereon, is adapted to be electrically received within the slot (56) of the card edge connector (44) which is directly electrically mounted onto the mother board (33).
    Type: Grant
    Filed: July 18, 1995
    Date of Patent: January 20, 1998
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hua-Tsong Pan, May Chen