Patents by Inventor May-Luen Chou

May-Luen Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Potted integrated circuit device with aluminum case
    Patent number: 8426253
    Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: April 23, 2013
    Assignee: Vishay General Semiconductor LLC
    Inventors: Peter Chou, Lucy Tian, Ivan Fu, Samuel Li, May-Luen Chou
  • POTTED INTEGRATED CIRCUIT DEVICE WITH ALUMINUM CASE
    Publication number: 20120252167
    Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.
    Type: Application
    Filed: June 11, 2012
    Publication date: October 4, 2012
    Applicant: VISHAY GENERAL SEMICONDUCTOR LLC
    Inventors: Peter Chou, Lucy Tian, Ivan Fu, Samuel Li, May-Luen Chou
  • Potted integrated circuit device with aluminum case
    Patent number: 8198709
    Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.
    Type: Grant
    Filed: October 18, 2006
    Date of Patent: June 12, 2012
    Assignee: Vishay General Semiconductor LLC
    Inventors: Peter Chou, Lucy Tian, Ivan Fu, Samuel Li, May-Luen Chou