Abstract: Disclosed is a stress buffer structure intended to be disposed adjacent a face of a semiconductor substrate. The stress buffer structure includes at least one polymer layer formed on the face of the semiconductor substrate and a plurality of metal plates disposed over the polymer layer, wherein the metal plates is physically and electrically isolated from the bond pads of the semiconductor substrate. The disclosed stress buffer structure provides protection to semiconductor components that are sensitive to stress. Also disclosed are semiconductor packages having the disclosed stress buffer structure and the methods of making the semiconductor packages.