Patents by Inventor May Tin Hng

May Tin Hng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic Component and Method for its Production
    Publication number: 20090250807
    Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).
    Type: Application
    Filed: May 4, 2009
    Publication date: October 8, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Chee Chian Lim, Yoke Chin Goh, Koh Hoo Goh, May Tin Hng