Patents by Inventor May Wang

May Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7407893
    Abstract: Methods are provided for depositing amorphous carbon materials. In one aspect, the invention provides a method for processing a substrate including positioning the substrate in a processing chamber, introducing a processing gas into the processing chamber, wherein the processing gas comprises a carrier gas, hydrogen, and one or more precursor compounds, generating a plasma of the processing gas by applying power from a dual-frequency RF source, and depositing an amorphous carbon layer on the substrate.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: August 5, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Martin Jay Seamons, Wendy H. Yeh, Sudha S. R. Rathi, Deenesh Padhi, Andy (Hsin Chiao) Luan, Sum-Yee Betty Tang, Priya Kulkarni, Visweswaren Sivaramakrishnan, Bok Hoen Kim, Hichem M'Saad, Yuxiang May Wang, Michael Chiu Kwan
  • Patent number: 7335462
    Abstract: A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert gas. The amorphous carbon film is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, the amorphous carbon film is used as a hardmask. In another integrated circuit fabrication process, the amorphous carbon film is an anti-reflective coating (ARC) for deep ultraviolet (DUV) lithography. In yet another integrated circuit fabrication process, a multi-layer amorphous carbon anti-reflective coating is used for DUV lithography.
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: February 26, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Kevin Fairbairn, Michael Rice, Timothy Weidman, Christopher S Ngai, Ian Scot Latchford, Christopher Dennis Bencher, Yuxiang May Wang
  • Patent number: 7322554
    Abstract: A holder for a clothing article, such as a purse, scarf, or glove, the holder generally including a base and a hanger, wherein the hanger supports the clothing article but does not compress the clothing article.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: January 29, 2008
    Assignee: C & W Design, LLC
    Inventors: Carol Caroselli, May Wang
  • Patent number: 7223526
    Abstract: A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert gas. The amorphous carbon film is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, the amorphous carbon film is used as a hardmask. In another integrated circuit fabrication process, the amorphous carbon film is an anti-reflective coating (ARC) for deep ultraviolet (DUV) lithography. In yet another integrated circuit fabrication process, a multi-layer amorphous carbon anti-reflective coating is used for DUV lithography.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: May 29, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Kevin Fairbairn, Michael Rice, Timothy Weidman, Christopher S Ngai, Ian Scot Latchford, Christopher Dennis Bencher, Yuxiang May Wang
  • Patent number: 7105460
    Abstract: Methods are provided for depositing a dielectric material. The dielectric material may be used for an anti-reflective coating or as a hardmask. In one aspect, a method is provided for processing a substrate including introducing a processing gas comprising a silane-based compound and an organosilicon compound to the processing chamber and reacting the processing gas to deposit a nitrogen-free dielectric material on the substrate. The dielectric material comprises silicon and oxygen.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: September 12, 2006
    Assignee: Applied Materials
    Inventors: Bok Hoen Kim, Sudha Rathi, Sang H. Ahn, Christopher D. Bencher, Yuxiang May Wang, Hichem M'Saad, Mario D. Silvetti
  • Patent number: 6927178
    Abstract: Methods are provided for depositing a dielectric material. The dielectric material may be used for an anti-reflective coating or as a hardmask. In one aspect, a method is provided for processing a substrate including introducing a processing gas comprising a silane-based compound and an oxygen and carbon containing compound to the processing chamber and reacting the processing gas to deposit a nitrogen-free dielectric material on the substrate. The dielectric material comprises silicon and oxygen. In another aspect, the dielectric material forms one or both layers in a dual layer anti-reflective coating.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: August 9, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Bok Hoen Kim, Sudha Rathi, Sang H. Ahn, Christopher D. Bencher, Yuxiang May Wang, Hichem M'Saad, Mario D. Silvetti, Miguel Fung, Keebum Jung, Lei Zhu
  • Publication number: 20050082319
    Abstract: A holder for a clothing article, such as a purse, scarf, or glove, the holder generally including a base and a hanger, wherein the hanger supports the clothing article but does not compress the clothing article.
    Type: Application
    Filed: September 3, 2004
    Publication date: April 21, 2005
    Inventors: Carol Caroselli, May Wang
  • Patent number: 6841341
    Abstract: A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert gas. The amorphous carbon film is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, the amorphous carbon film is used as a hardmask. In another integrated circuit fabrication process, the amorphous carbon film is an anti-reflective coating (ARC) for deep ultraviolet (DUV) lithography. In yet another integrated circuit fabrication process, a multi-layer amorphous carbon anti-reflective coating is used for DUV lithography.
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: January 11, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Kevin Fairbairn, Michael Rice, Timothy Weidman, Christopher S Ngai, Ian Scot Latchford, Christopher Dennis Bencher, Yuxiang May Wang
  • Publication number: 20040214446
    Abstract: Methods are provided for depositing a dielectric material. The dielectric material may be used for an anti-reflective coating or as a hardmask. In one aspect, a method is provided for processing a substrate including introducing a processing gas comprising a silane-based compound and an oxygen and carbon containing compound to the processing chamber and reacting the processing gas to deposit a nitrogen-free dielectric material on the substrate. The dielectric material comprises silicon and oxygen. In another aspect, the dielectric material forms one or both layers in a dual layer anti-reflective coating.
    Type: Application
    Filed: December 10, 2003
    Publication date: October 28, 2004
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Bok Hoen Kim, Sudha Rathi, Sang H. Ahn, Christopher D. Bencher, Yuxiang May Wang, Hichem M'Saad, Mario D. Silvetti, Miguel Fung, Keebum Jung, Lei Zhu
  • Publication number: 20040009676
    Abstract: Methods are provided for depositing a dielectric material. The dielectric material may be used for an anti-reflective coating or as a hardmask. In one aspect, a method is provided for processing a substrate including introducing a processing gas comprising a silane-based compound and an organosilicon compound to the processing chamber and reacting the processing gas to deposit a nitrogen-free dielectric material on the substrate. The dielectric material comprises silicon and oxygen.
    Type: Application
    Filed: July 11, 2002
    Publication date: January 15, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Bok Hoen Kim, Sudha Rathi, Sang H. Ahn, Christopher D. Bencher, Yuxiang May Wang, Hichem M'Saad, Mario D. Silvetti
  • Publication number: 20030150889
    Abstract: A holder for a clothing article, such as a purse, scarf, or glove, the holder generally including a base and a hanger, wherein the hanger supports the clothing article but does not compress the clothing article.
    Type: Application
    Filed: February 13, 2002
    Publication date: August 14, 2003
    Inventors: Carol Caroselli, May Wang
  • Patent number: 6573030
    Abstract: A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert gas. The amorphous carbon film is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, the amorphous carbon film is used as a hardmask. In another integrated circuit fabrication process, the amorphous carbon film is an anti-reflective coating (ARC) for deep ultraviolet (DUV) lithography. In yet another integrated circuit fabrication process, a multi-layer amorphous carbon anti-reflective coating is used for DUV lithography.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: June 3, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Kevin Fairbairn, Michael Rice, Timothy Weidman, Christopher S Ngai, Ian Scot Latchford, Christopher Dennis Bencher, Yuxiang May Wang
  • Publication number: 20030091938
    Abstract: A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert gas. The amorphous carbon film is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, the amorphous carbon film is used as a hardmask. In another integrated circuit fabrication process, the amorphous carbon film is an anti-reflective coating (ARC) for deep ultraviolet (DUV) lithography. In yet another integrated circuit fabrication process, a multi-layer amorphous carbon anti-reflective coating is used for DUV lithography.
    Type: Application
    Filed: December 17, 2002
    Publication date: May 15, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Kevin Fairbairn, Michael Rice, Timothy Weidman, Christopher S. Ngai, Ian Scot Latchford, Christopher Dennis Bencher, Yuxiang May Wang
  • Publication number: 20020086547
    Abstract: A multilayer antireflective hard mask structure is disclosed. The structure comprises: (a) a CVD organic layer, wherein the CVD organic layer comprises carbon and hydrogen; and (b) a dielectric layer over the CVD organic layer. The dielectric layer is preferably a silicon oxynitride layer, while the CVD organic layer preferably comprises 70-80% carbon, 10-20% hydrogen and 5-15% nitrogen. Also disclosed are methods of forming and trimming such a multilayer antireflective hard mask structure. Further disclosed are methods of etching a substrate structure using a mask structure that contains a CVD organic layer and optionally has a dielectric layer over the CVD organic layer.
    Type: Application
    Filed: July 13, 2001
    Publication date: July 4, 2002
    Applicant: Applied Materials, Inc.
    Inventors: David S. Mui, Wei Liu, Thorsten Lill, Christopher Dennis Bencher, Yuxiang May Wang
  • Patent number: 6350866
    Abstract: The invention provides isolated nucleic acid compounds encoding FtsZ of Streptococcus pneumoniae. Also provided are vectors and transformed host cells for expressing the encoded protein, and a method for identifying compounds that bind and/or inhibit said protein.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: February 26, 2002
    Assignee: Eli Lilly and Company
    Inventors: Paul Luther Skatrud, Robert Brown Peery, Q May Wang, Paul Robert Rosteck, Jr., Pamela Kay Rockey
  • Patent number: 6192215
    Abstract: A mechanical puppet show apparatus provides a base unit supporting on its upper surface (stage) one or more mechanical puppets. The puppets are interconnected with a circuit for motion actuation in accordance with a stage play that is programmed into a memory device and controlled by a digital control unit. Manual, remote control and verbal signals may be received for interactive action of the puppets with the audience. A method for use of materials downloaded by packet data transfer from the Internet may be employed in programming.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: February 20, 2001
    Inventor: Mai Wang
  • Patent number: 6136557
    Abstract: The invention provides isolated nucleic acid compounds encoding FtsH of Streptococcus pneumoniae. Also provided are vectors and transformed host cells for expressing the encoded protein, and a method for identifying compounds that bind and/or inhibit said protein.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: October 24, 2000
    Assignee: Eli Lilly and Company
    Inventors: Robert Brown Peery, Paul Luther Skatrud, Q May Wang, Michele Louise Young Bellido
  • Patent number: 6039625
    Abstract: A mechanical puppet show apparatus provides a base unit supporting on its upper surface (stage) one or more mechanical puppets. The puppets are interconnected with a circuit for motion actuation in accordance with a stage play that is programmed into a memory device and controlled by a digital control unit. Manual, remote control and verbal signals may be received for interactive action of the puppets with the audience.
    Type: Grant
    Filed: October 23, 1998
    Date of Patent: March 21, 2000
    Inventor: Mai Wang
  • Patent number: 5958730
    Abstract: The invention provides isolated nucleic acid compounds encoding FtsY of Streptococcus pneumoniae. Also provided are vectors and transformed host cells for expressing the encoded protein, and a method for identifying compounds that bind and/or inhibit said protein.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: September 28, 1999
    Assignee: Eli Lilly and Company
    Inventors: Paul Luther Skatrud, Robert Brown Peery, Q May Wang, Paul Robert Rosteck, Jr., Michele Louise Young Bellido
  • Patent number: 5811344
    Abstract: The present invention relates to a stacked capacitor of a DRAM cell, particully remarkably increasing a surface area of a storage electrode of a stacked capacitor without increasing an occupation area and a complexity of fabrication thereof. According to the invention, by use of depositing a protection polysilicon layer on a rugged polysilicon layer, which can provide an increased surface area of a storage electrode, a chemical oxide layer underlying the rugged polysilicon layer is protected by the protection polysilicon layer during a HF dip and thus a peeling of the rugged polysilicon layer as a result of the chemical oxide loss will not occur, thereby preventing a production yield loss.
    Type: Grant
    Filed: January 27, 1997
    Date of Patent: September 22, 1998
    Assignee: Mosel Vitelic Incorporated
    Inventors: Tuby Tu, Kuang-Chao Chen, May Wang