Patents by Inventor May Yu

May Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Restoring low dielectric constant film properties
    Patent number: 8058183
    Abstract: A method for restoring the dielectric constant of a low dielectric constant film is described. A porous dielectric layer having a plurality of pores is formed on a substrate. The plurality of pores is then filled with an additive to provide a plugged porous dielectric layer. Finally, the additive is removed from the plurality of pores.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: November 15, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Zhenjiang Cui, May Yu, Alexandros T. Demos, Mehul Naik
  • RESTORING LOW DIELECTRIC CONSTANT FILM PROPERTIES
    Publication number: 20090317971
    Abstract: A method for restoring the dielectric constant of a low dielectric constant film is described. A porous dielectric layer having a plurality of pores is formed on a substrate. The plurality of pores is then filled with an additive to provide a plugged porous dielectric layer. Finally, the additive is removed from the plurality of pores.
    Type: Application
    Filed: June 9, 2009
    Publication date: December 24, 2009
    Inventors: Zhenjiang Cui, May Yu, Alexandros T. Demos, Mehul Naik
  • Polishing method that suppresses hillock formation
    Publication number: 20070235345
    Abstract: An ECMP method that suppresses hillock formation on a substrate includes the step of buffing a substrate before a two-step electrochemical mechanical polishing process. The buffing step prevents hillocks from forming around the features of the substrate and does not interfere with the protrusion formation. The buffing step includes contacting the substrate with a polishing pad and rotating the substrate and the polishing pad in opposite directions.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Inventors: Tianbao Du, Feng Liu, May Yu, Alan Duboust, Wei-Yung Hsu
  • Removal profile tuning by adjusting conditioning sweep profile on a conductive pad
    Publication number: 20070227902
    Abstract: A method for controlling the removal rate of material from a substrate during a polishing process is described. In one embodiment, the pre-polish profile of the substrate is determined and polishing pad conditioning parameters are adjusted based on that profile. Parameters such as conditioning head sweep range and frequency, and conditioning element downforce and RPM may be adjusted to selectively condition portions of the pad to maintain optimum polishing qualities of the pad.
    Type: Application
    Filed: March 29, 2006
    Publication date: October 4, 2007
    Inventors: Tianbao Du, Feng Liu, May Yu, Alain Duboust, Wei-Yung Hsu