Patents by Inventor Maya HYAKUDOMI

Maya HYAKUDOMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board and information processing apparatus
    Patent number: 11612055
    Abstract: In a printed wiring board, one transmitting circuit and N (N is an integer of 3 or more) receiving circuits are coupled by a multi-point wiring. First to N-th branch points are provided in sequence in the multi-point wiring having one end coupled to the transmitting circuit. Wirings branched at the respective branch points are coupled to the respective receiving circuits. Here, a wiring length from a coupling point of the transmitting circuit to a first branch point is configured to be longer than a wiring length from the first branch point to the second branch point. Wiring lengths between the adjacent branch points at and after a second branch point are configured to be shorter than the wiring length from the first branch point to the second branch point.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: March 21, 2023
    Assignee: HITACHI, LTD.
    Inventors: Goro Hamamoto, Yutaka Uematsu, Yohei Oshima, Maya Hyakudomi
  • PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS
    Publication number: 20220030706
    Abstract: In a printed wiring board, one transmitting circuit and N (N is an integer of 3 or more) receiving circuits are coupled by a multi-point wiring. First to N-th branch points are provided in sequence in the multi-point wiring having one end coupled to the transmitting circuit. Wirings branched at the respective branch points are coupled to the respective receiving circuits. Here, a wiring length from a coupling point of the transmitting circuit to a first branch point is configured to be longer than a wiring length from the first branch point to the second branch point. Wiring lengths between the adjacent branch points at and after a second branch point are configured to be shorter than the wiring length from the first branch point to the second branch point.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 27, 2022
    Inventors: Goroh HAMAMOTO, Yutaka UEMATSU, Yohei OSHIMA, Maya HYAKUDOMI