Patents by Inventor Maya INAGAKI
Maya INAGAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11728642Abstract: In one embodiment, a protection circuit in a semiconductor device includes first and second transistors including gates electrically connected to a first node, and connected in series to each other between the first and second lines, third and fourth transistors including gates electrically connected to a second node between the first and second transistors, and connected in series to each other between the first and second lines, and a fifth transistor including a gate electrically connected to a third node between the third and fourth transistors, and provided between the second node and the second line. The protection circuit further includes an arithmetic circuit configured to perform calculation using a first signal received from the second node to output a second signal, and a sixth transistor configured to receive the second signal to output a control signal to the arithmetic circuit.Type: GrantFiled: September 14, 2021Date of Patent: August 15, 2023Assignee: Kioxia CorporationInventors: Shigefumi Ishiguro, Yasuhiro Suematsu, Takeshi Miyaba, Kimimasa Imai, Maya Inagaki
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Publication number: 20220285337Abstract: In one embodiment, a semiconductor device includes substrate, a plurality of electrode layers provided above the substrate, and separated from each other in a first direction perpendicular to a surface of the substrate, and a first plug provided in the plurality of electrode layers. The device further includes first and second diffusion layers provided in the substrate, one of the first and second diffusion layers functioning as an anode layer of an ESD (electrostatic discharge) protection circuit, the other of the first and second diffusion layers functioning as a cathode layer of the ESD protection circuit, a second plug provided at a position that overlaps with the first diffusion layer in planar view, and electrically connected with the first diffusion layer, and a third plug provided at a position that does not overlap with the first diffusion layer in planar view, and electrically connected with the first diffusion layer.Type: ApplicationFiled: June 17, 2021Publication date: September 8, 2022Applicant: Kioxia CorporationInventors: Yasuhiro SUEMATSU, Maya INAGAKI
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Publication number: 20220285934Abstract: In one embodiment, a protection circuit in a semiconductor device includes first and second transistors including gates electrically connected to a first node, and connected in series to each other between the first and second lines, third and fourth transistors including gates electrically connected to a second node between the first and second transistors, and connected in series to each other between the first and second lines, and a fifth transistor including a gate electrically connected to a third node between the third and fourth transistors, and provided between the second node and the second line. The protection circuit further includes an arithmetic circuit configured to perform calculation using a first signal received from the second node to output a second signal, and a sixth transistor configured to receive the second signal to output a control signal to the arithmetic circuit.Type: ApplicationFiled: September 14, 2021Publication date: September 8, 2022Applicant: Kioxia CorporationInventors: Shigefumi ISHIGURO, Yasuhiro SUEMATSU, Takeshi MIYABA, Kimimasa IMAI, Maya INAGAKI
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Patent number: 10622074Abstract: According to an embodiment, a semiconductor storage device includes a first chip including a power supply protection circuit. The power supply protection circuit including: a resistor including a first end connected to the second pad; a first capacitor including a first end connected to a second end of the resistor; a first transistor including a first end connected to the second pad, a second end connected to a node with a signal of a value based on a voltage of the first end of the first capacitor, and a gate connected to the first pad; a first inverter including an input terminal connected to the second end of the first transistor; and a second transistor including a gate connected to an output terminal of the first inverter.Type: GrantFiled: September 11, 2017Date of Patent: April 14, 2020Assignee: TOSHIBA MEMORY CORPORATIONInventors: Maya Inagaki, Masaru Koyanagi
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Publication number: 20180233205Abstract: According to an embodiment, a semiconductor storage device includes a first chip including a power supply protection circuit. The power supply protection circuit including: a resistor including a first end connected to the second pad; a first capacitor including a first end connected to a second end of the resistor; a first transistor including a first end connected to the second pad, a second end connected to a node with a signal of a value based on a voltage of the first end of the first capacitor, and a gate connected to the first pad; a first inverter including an input terminal connected to the second end of the first transistor; and a second transistor including a gate connected to an output terminal of the first inverter.Type: ApplicationFiled: September 11, 2017Publication date: August 16, 2018Applicant: TOSHIBA MEMORY CORPORATIONInventors: Maya INAGAKI, Masaru KOYANAGI
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Patent number: 9589946Abstract: According to one embodiment, a semiconductor device includes a first semiconductor chip; a first wiring and a second wiring which are provided above a first surface of the first semiconductor chip; a first terminal connected to one end of the first wiring and one end of the second wiring, and connected to an outside; a second terminal connected to the other end of the first wiring; and a third terminal connected to the other end of the second wiring, and connected to the second terminal.Type: GrantFiled: September 3, 2015Date of Patent: March 7, 2017Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Maya Inagaki, Masaru Koyanagi, Mikihiko Ito
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Publication number: 20160322341Abstract: According to one embodiment, a semiconductor device includes a first semiconductor chip; a first wiring and a second wiring which are provided above a first surface of the first semiconductor chip; a first terminal connected to one end of the first wiring and one end of the second wiring, and connected to an outside; a second terminal connected to the other end of the first wiring; and a third terminal connected to the other end of the second wiring, and connected to the second terminal.Type: ApplicationFiled: September 3, 2015Publication date: November 3, 2016Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Maya INAGAKI, Masaru KOYANAGI, Mikihiko ITO
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Patent number: 8872562Abstract: According to one embodiment, a semiconductor device includes a first differential amplifier and a second differential amplifier. The first differential amplifier charges the first output terminal with a second voltage different from a first voltage. The first differential amplifier uses a first clock signal, stopping the charging at the first output terminal, receives first complementary data of the first voltage at the rising edge of a second clock signal, and outputs the first complementary data at the second voltage. The second differential amplifier charges the second output terminal with the second voltage. The second differential amplifier uses a third clock signal, stopping the charging at the second output terminal, receives second complementary data of the first voltage at the rising edge of a fourth clock signal, and outputs the second complementary data at the second voltage.Type: GrantFiled: September 6, 2013Date of Patent: October 28, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Mikihiko Ito, Masaru Koyanagi, Masami Masuda, Maya Inagaki
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Publication number: 20140285247Abstract: According to one embodiment, a semiconductor device includes a first differential amplifier and a second differential amplifier. The first differential amplifier charges the first output terminal with a second voltage different from a first voltage. The first differential amplifier uses a first clock signal, stopping the charging at the first output terminal, receives first complementary data of the first voltage at the rising edge of a second clock signal, and outputs the first complementary data at the second voltage. The second differential amplifier charges the second output terminal with the second voltage. The second differential amplifier uses a third clock signal, stopping the charging at the second output terminal, receives second complementary data of the first voltage at the rising edge of a fourth clock signal, and outputs the second complementary data at the second voltage.Type: ApplicationFiled: September 6, 2013Publication date: September 25, 2014Inventors: Mikihiko ITO, Masaru KOYANAGI, Masami MASUDA, Maya INAGAKI