Patents by Inventor Maya Obata

Maya Obata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981249
    Abstract: A headlamp control device includes a headlamp control unit for controlling headlamps so as to regulate an irradiation amount, the headlamps being installed in a vehicle equipped with an autonomous driving mode driven in accordance with images acquired by a visible light camera for capturing the circumference of the vehicle and a manual driving mode driven by a driver of the vehicle. The headlamp control unit decreases the irradiation amount of the headlamps in the autonomous driving mode so as to be smaller than the irradiation amount of the headlamps in the manual driving mode.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: May 14, 2024
    Assignees: Nissan Motor Co., Ltd., RENAULT S.A.S.
    Inventors: Masayoshi Obata, Takashi Ashida, Maya Fujita
  • Patent number: 5295045
    Abstract: A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.
    Type: Grant
    Filed: November 14, 1991
    Date of Patent: March 15, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Makoto Kitano, Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Maya Obata, Ryuji Kohno, Mitsuaki Haneda
  • Patent number: 5256903
    Abstract: A plastic encapsulated semiconductor device containing one or more of insulating films. Uneven surfaces, such as recesses and roughened surfaces, are strategically provided on peripheral side (edge) surfaces of the insulating films. As a result, therefore, an interface separation does not easily occur between the side surfaces of the insulating films and the encapsulating resin. If such an interface separation should occur, it cannot develop easily. Thus, it is possible to obtain a plastic encapsulated semiconductor device of a high level of reliability even when the largest possible semiconductor element is mounted therein within limited outside dimensions.
    Type: Grant
    Filed: November 26, 1991
    Date of Patent: October 26, 1993
    Assignee: Hitachi Ltd.
    Inventors: Maya Obata, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Ryuji Kohno, Nae Yoneda, Ichiro Anjoh, Gen Murakami