Abstract: A surveillance system can include a first sensor apparatus configured to interrogate a subject, including a person and objects carried by the person, with millimeter-wave electromagnetic radiation for imaging the subject. A supplemental source provides additional information about the subject that is relatable to objects potentially carried by the person. Relational information relates the produced image signal and the subject information. The supplemental source may be a second sensor apparatus adapted to detect a given characteristic of an object potentially carried by a person in the subject position. Relational information about whether the person is carrying an object having the given characteristic may then be produced.

Abstract: A surveillance system can include a first sensor apparatus configured to interrogate a subject, including a person and objects carried by the person, with millimeter-wave electromagnetic radiation for imaging the subject. A supplemental source provides additional information about the subject that is relatable to objects potentially carried by the person. Relational information relates the produced image signal and the subject information. The supplemental source may be a second sensor apparatus adapted to detect a given characteristic of an object potentially carried by a person in the subject position. Relational information about whether the person is carrying an object having the given characteristic may then be produced.

Abstract: A surveillance system can include a first sensor apparatus configured to interrogate a subject, including a person and objects carried by the person, with millimeter-wave electromagnetic radiation for imaging the subject. A supplemental source provides additional information about the subject that is relatable to objects potentially carried by the person. Relational information relates the produced image signal and the subject information. The supplemental source may be a second sensor apparatus adapted to detect a given characteristic of an object potentially carried by a person in the subject position. Relational information about whether the person is carrying an object having the given characteristic may then be produced.

Abstract: An imaging system can include an antenna apparatus configured to transmit toward and receive from a subject in a subject position, millimeter-wave electromagnetic radiation. A subject may include a person and any object or objects with the person. A controller can include a transceiver configured to operate the antenna apparatus and produce an output representative of the received radiation, and a processor adapted to produce from the transceiver output, image data representative of an image of the subject. At least a first portion of an image signal representative of radiation received by an antenna apparatus may be used to produce first image data representative of a first image of at least a portion of the subject. Second image data representative of a second image having resolution that is different than that of the first image may be produced from at least a second portion of the image signal.

Abstract: An imaging system can include an antenna apparatus configured to transmit toward and receive from a subject in a subject position, millimeter-wave electromagnetic radiation. A subject may include a person and any object or objects with the person. A controller can include a transceiver configured to operate the antenna apparatus and produce an output representative of the received radiation, and a processor adapted to produce from the transceiver output, image data representative of an image of the subject. At least a first portion of an image signal representative of radiation received by an antenna apparatus may be used to produce first image data representative of a first image of at least a portion of the subject. Second image data representative of a second image having resolution that is different than that of the first image may be produced from at least a second portion of the image signal.

Abstract: A method and associated apparatus for creating a defect knowledge library containing case study information of wafer defects on semiconductor wafers. The method comprises creating a database entry that contains a case study of a specific defect including defect information that comprises one or more defect images and storing the database entry for subsequent access. The database entries are stored on a server and are accessible by a plurality of clients.

Abstract: A method and apparatus for providing communication between a defect source identifier and a tool data collection and control system. The defect source identifier collects wafer data until a defect is identified. Upon identification of a defect, a request is sent to the tool data collection and control system to request data of the tool parameters at the time the defect occurred. The tool data collection and control system retrieves the tool parameters and communicates them to the defect source identifier through a network. The tool parameters are processed by the defect source identifier to extract certain wafer data. The selected wafer data is communicated to the tool data collection and control system and is used to execute a prediction model to predict failure possible of the tool elements.

Abstract: A method and associated apparatus of analyzing defects on semiconductor wafers. The method includes identifying defects on the semiconductor wafer. Defect inspection information is created within a defect source identifier client. The defect inspection information containing information regarding the identified defects. The defect inspection information is transmitted through a network to a defect source identifier server. Defect source information is derived at the defect source identifier server in response to the defect inspection information. The defect source information is transmitted from the defect source identifier server to the defect source identifier client. The defect source information is utilized at the defect source identifier client. In one aspect, the utilizing the defect solution information involves displaying defect solutions to the defect at the defect source identifier client in response to the defect solution information.

Abstract: A method and associated apparatus of analyzing defects on semiconductor wafers. The method includes identifying defects on the semiconductor wafer. Defect inspection information is created within a defect source identifier client. The defect inspection information containing information regarding the identified defects. The defect inspection information is transmitted through a network to a defect source identifier server. Defect source information is derived at the defect source identifier server in response to the defect inspection information. The defect source information is transmitted from the defect source identifier server to the defect source identifier client. The defect source information is utilized at the defect source identifier client. In one aspect, the utilizing the defect solution information involves displaying defect solutions to the defect at the defect source identifier client in response to the defect solution information.

Abstract: A method and associated apparatus for creating a defect knowledge library containing case study information of wafer defects on semiconductor wafers. The method comprises creating a database entry that contains a case study of a specific defect including defect information that comprises one or more defect images and storing the database entry for subsequent access. The database entries are stored on a server and are accessible by a plurality of clients.

Abstract: A method and apparatus for providing communication between a defect source identifier and a tool data collection and control system. The defect source identifier collects wafer data until a defect is identified. Upon identification of a defect, a request is sent to the tool data collection and control system to request data of the tool parameters at the time the defect occurred. The tool data collection and control system retrieves the tool parameters and communicates them to the defect source identifier through a network. The tool parameters are processed by the defect source identifier to extract certain wafer data. The selected wafer data is communicated to the tool data collection and control system and is used to execute a prediction model to predict failure possible of the tool elements.

Abstract: A method and associated apparatus for communicating defect information between a defect source identifier server and client. The method comprises creating defect inspection information within a defect source identifier client, the defect inspection information containing information regarding identified defects on semiconductor wafers. In one aspect, an XML converter converts the defect inspection information into converted defect inspection information that is in a form defined by user defined tags. The converted defect inspection information is transmitted through a network to a defect source identifier server. Defect source information is derived at the defect source identifier server in response to the converted defect inspection information.

Abstract: A method, computer readable medium and apparatus comprising a defect knowledge library (DKL), subscriber equipment and a communications network that connects the subscriber equipment t the DKL. The DKL contains a partitioned database of defect, defect source and defect mitigation information that is arranged by participating integrated circuit fabricator (referred to herein as a subscriber). The subscribers can identify the amount and type of information that they wish to share with other subscribers and whether their identity will be disclosed. The subscribers may share the data with specific “partners” or with other departments within their company, without sharing with other subscribers. The DKL system administrator charges a fee for the access rights. The more information that a subscriber shares with other subscribers, the lower the access fee. As such, subscribers are given financial incentive to share their information with other subscribers.