Abstract: Disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive, in turn comprising at least one first homogenous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350° F. (177° C.), up to 60 weight percent wax and up to 40 weight percent tackifier. In particular, disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20 &agr;-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) up to 60 weight percent of at least one tackifying resin; and c) up to 40 weight percent of at least one wax, wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/(cm.second)) at 150° C.

Abstract: Disclosed are hot melt adhesives comprising at least one first homogeneous linear etylene polymer having a particular density and melt viscosity at 350.degree.F. (177.degree.C.), and an optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least ibe C.sub.2 --C.sub.20 .alpha.-olefin interpolymer having a density from 0.850 g/cm.sup.3 to 0.895 g/cm.sup.3 ; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/cm.second) at 150.degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.