Patents by Inventor Mayo Uenoyama

Mayo Uenoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8147911
    Abstract: A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: April 3, 2012
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yasuhiro Okuda, Fumihiro Hayashi, Tsuyoshi Haga, Taro Fujita, Mayo Uenoyama, Yasuhito Masuda, Yuichi Idomoto
  • Patent number: 7807066
    Abstract: A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
    Type: Grant
    Filed: July 11, 2005
    Date of Patent: October 5, 2010
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Mayo Uenoyama, Yasuhiro Okuda, Fumihiro Hayashi, Taro Fujita, Yasuhito Masuda, Yuichi Idomoto
  • Publication number: 20080006605
    Abstract: A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
    Type: Application
    Filed: July 11, 2005
    Publication date: January 10, 2008
    Inventors: Mayo Uenoyama, Yasuhiro Okuda, Fumihiro Hayashi, Taro Fujita, Yasuhito Masuda, Yuichi Idomoto
  • Publication number: 20060141159
    Abstract: A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.
    Type: Application
    Filed: June 4, 2004
    Publication date: June 29, 2006
    Inventors: Yasuhiro Okuda, Fumihiro Hayashi, Tsuyoshi Haga, Taro Fujita, Mayo Uenoyama, Yasuhito Masuda, Yuichi Idomoto