Patents by Inventor Mayuka OJIMA

Mayuka OJIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE
    Publication number: 20230317632
    Abstract: A semiconductor device according to an embodiment includes a substrate, a transistor, an insulating layer, and a first sealing portion. The substrate includes a first region, and a second region provided to surround an outer periphery of the first region. The transistor is provided on the substrate in the first region. The insulating layer is provided above the transistor and over the first region and the second region. The first sealing portion is provided to divide the insulating layer and surround the outer periphery of the first region in the second region. The first sealing portion includes a first void.
    Type: Application
    Filed: August 9, 2022
    Publication date: October 5, 2023
    Applicant: Kioxia Corporation
    Inventors: Mayuka OJIMA, Sachiyo ITO, Takuya KONNO