Abstract: A radio-frequency module includes: a module substrate; multiple external connection terminals that are arranged on a main surface of the module substrate; an integrated circuit that is arranged on a main surface of the module substrate; a shield layer that is arranged above the main surface of the integrated circuit; and a metal member that is arranged between the main surface of the integrated circuit and the shield layer. The integrated circuit includes transistors arranged on the main surface and constituting a power amplifier and via conductors connecting the transistors to the metal member. The metal member at least partially overlaps the via conductors and at least partially overlaps the shield layer in a plan view of the module substrate.

Abstract: Heat dissipation properties of a power amplifier is improved. A high-frequency module includes a mounting substrate, at least one power amplifier, an electronic component, a resin layer, a conductive member, and a plurality of via conductors. The power amplifier is mounted on a first main surface of the mounting substrate. The electronic component is mounted on a second main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate, and covers at least a part of the power amplifier. The conductive member covers at least a part of the resin layer, and covers at least a part of an outer peripheral surface of the mounting substrate. The plurality of via conductors is connected to the power amplifier, and passes through the mounting substrate. At least one via conductor of the plurality of via conductors is in contact with the conductive member.

Abstract: In a radio frequency module, a resin layer is disposed on a first main surface of a mounting substrate and covers electronic components. An external shield layer covers at least part of an outer peripheral surface of the mounting substrate and the resin layer. The mounting substrate includes a first dielectric layer, a second dielectric layer, and ground electrodes. The first dielectric layer contains a resin and does not contain a glass fiber. The second dielectric layer overlaps the first dielectric layer in a thickness direction of the mounting substrate and is in contact with the first dielectric layer. The second dielectric layer contains a resin and does not contain a glass fiber. The ground electrodes are interposed between the first dielectric layer and the second dielectric layer. The ground electrodes are each directly connected to the external shield layer.

Abstract: In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

Abstract: An acoustic wave filter includes a first series arm resonance unit in a series arm path connecting a first input/output terminal and a second input/output terminal, and a first parallel arm resonance unit between the series arm path and a ground, in which each of the first series arm resonance unit and the first parallel arm resonance unit includes an acoustic wave resonator, a first resonant frequency of the first series arm resonance unit and a second resonant frequency of the first parallel arm resonance unit are equal to or lower than a low frequency end of a pass band of the acoustic wave filter, a first anti-resonant frequency of the first series arm resonance unit and a second anti-resonant frequency of the first parallel arm resonance unit are equal to or higher than a high frequency end of the pass band.

Abstract: A composite filter component includes a filter causing a signal of a band AL reception band to pass through, a filter causing a signal of a band BL reception band to pass through, a filter causing a signal of a band AM reception band configured to be simultaneously received with a signal of the band AL to pass through, a filter causing a signal of a band BM reception band configured to be simultaneously received with a signal of the band BL to pass through.

Abstract: A radio frequency module that can improve heat dissipation properties and shielding properties is provided. In a radio frequency module, an electronic component has a main surface on an opposite side of a mounting board side and an outer peripheral surface. A resin layer covers at least a part of the outer peripheral surface of the electronic component. A metal electrode layer covers the main surface of the electronic component and a main surface of the resin layer on the opposite side of the mounting board side. In plan view from a thickness direction of a mounting board, an outer edge of the main surface of the electronic component is located on an inner side of an outer edge of the electronic component. The electronic component further has an inclined surface.

Abstract: A radio-frequency module includes: a module substrate; multiple external connection terminals that are arranged on a main surface of the module substrate; an integrated circuit that is arranged on a main surface of the module substrate; a shield layer that is arranged above the main surface of the integrated circuit; and a metal member that is arranged between the main surface of the integrated circuit and the shield layer. The integrated circuit includes transistors arranged on the main surface and constituting a power amplifier and via conductors connecting the transistors to the metal member. The metal member at least partially overlaps the via conductors and at least partially overlaps the shield layer in a plan view of the module substrate.

Abstract: Heat dissipation properties of a power amplifier is improved. A high-frequency module includes a mounting substrate, at least one power amplifier, an electronic component, a resin layer, a conductive member, and a plurality of via conductors. The power amplifier is mounted on a first main surface of the mounting substrate. The electronic component is mounted on a second main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate, and covers at least a part of the power amplifier. The conductive member covers at least a part of the resin layer, and covers at least a part of an outer peripheral surface of the mounting substrate. The plurality of via conductors is connected to the power amplifier, and passes through the mounting substrate. At least one via conductor of the plurality of via conductors is in contact with the conductive member.

Abstract: In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

Abstract: A mounting substrate has one main surface (a first main surface). An electronic component has a first face, a second face, and a side face, and is provided on the one main surface of the mounting substrate. A solder bump is disposed between the mounting substrate and the electronic component, and electrically connects the mounting substrate and the electronic component. A resin layer is provided on the one main surface of the mounting substrate to cover the electronic component. The first face is a face of the electronic component at a side opposite to the mounting substrate. The side face of the electronic component is in contact with the resin layer. A space is provided between at least a part of the first face and the resin layer in a thickness direction of the mounting substrate.