Abstract: Heat dissipation properties of a power amplifier is improved. A high-frequency module includes a mounting substrate, at least one power amplifier, an electronic component, a resin layer, a conductive member, and a plurality of via conductors. The power amplifier is mounted on a first main surface of the mounting substrate. The electronic component is mounted on a second main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate, and covers at least a part of the power amplifier. The conductive member covers at least a part of the resin layer, and covers at least a part of an outer peripheral surface of the mounting substrate. The plurality of via conductors is connected to the power amplifier, and passes through the mounting substrate. At least one via conductor of the plurality of via conductors is in contact with the conductive member.

Abstract: In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

Abstract: A mounting substrate has one main surface (a first main surface). An electronic component has a first face, a second face, and a side face, and is provided on the one main surface of the mounting substrate. A solder bump is disposed between the mounting substrate and the electronic component, and electrically connects the mounting substrate and the electronic component. A resin layer is provided on the one main surface of the mounting substrate to cover the electronic component. The first face is a face of the electronic component at a side opposite to the mounting substrate. The side face of the electronic component is in contact with the resin layer. A space is provided between at least a part of the first face and the resin layer in a thickness direction of the mounting substrate.