Abstract: Interconnects may comprise a sandwich-structured composite comprising a core layer located between two thermosetting polymer layers. The core layer may comprise 80 wt % to 95 wt % conductive metal and a polymer. The conductive metal may comprise silver (Ag). The polymer may comprise polydimethylsiloxane (PDMS). Interconnects may be particularly suited for use in electronic devices, such as a flexible batteries and wearable electronic devices.