Patents by Inventor Mayuko Takasu

Mayuko Takasu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9105822
    Abstract: The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition, comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b): (a) an aspect ratio 1.2 or more and 4.0 or less, and (b) a primary particle diameter 0.1 ?m or more and 2.0 ?m or less.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: August 11, 2015
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Mayuko Takasu, Takeshi Otsu, Kenichi Takizawa, Yutaka Mori
  • Publication number: 20140091266
    Abstract: The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition, comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b): (a) an aspect ratio 1.2 or more and 4.0 or less, and (b) a primary particle diameter 0.1 ?m or more and 2.0 ?m or less.
    Type: Application
    Filed: December 9, 2013
    Publication date: April 3, 2014
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Mayuko TAKASU, Takeshi Otsu, Kenichi Takizawa, Yutaka Mori
  • Publication number: 20120286220
    Abstract: The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b); (a) an aspect ratio 1.2 or more and 4.0 or less, and (b) a primary particle diameter 0.1 ?m or more and 2.0 ?m or less.
    Type: Application
    Filed: June 21, 2012
    Publication date: November 15, 2012
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Mayuko TAKASU, Takeshi Otsu, Kenichi Takizawa, Yutaka Mori
  • Publication number: 20100010148
    Abstract: Disclosed is a recording liquid including an aqueous pigment dispersion, which has high dispersion stability and high discharge properties and gives a print with superior gloss. Specifically, the aqueous pigment dispersion contains a pigment; a polymer containing cationic monomer structural units and hydrophobic monomer structural units (hydrophobic-group-containing cationic polymer); and a polymer containing anionic monomer structural units and hydrophobic monomer structural units (hydrophobic-group-containing anionic polymer), in which the ratio of the number of anionic groups in the hydrophobic-group-containing anionic polymer to the number of cationic groups in the hydrophobic-group-containing cationic polymer is 1.0 or more and 8 or less. The molar ratio of the hydrophobic monomer structural units to the anionic monomer structural units in the hydrophobic-group-containing anionic polymer is from 5/95 to 50/50 or the content of the pigment is 51 percent by weight or more based on the solids content.
    Type: Application
    Filed: February 18, 2008
    Publication date: January 14, 2010
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Shinichiro Imai, Masanobu Yokoyama, Takahiro Saito, Mayuko Takasu, Rie Nishida, Terutoshi Sato