Abstract: A film having a dielectric dissipation factor at a frequency of 1 kHz and 160° C. of 0.02% or lower and a dielectric breakdown strength at 160° C. of 400 V/?m or higher. Also disclosed is a film including at least one fluoropolymer selected from a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer, the fluoropolymer having a crystallinity of 65% or higher.

Abstract: The invention provides a film having a high relative permittivity, a high volume resistivity, and a high breakdown strength. The film has a relative permittivity of 9 or higher at a frequency of 1 kHz and 30° C., a volume resistivity of 5E+15 ?·cm or higher at 30° C., and a breakdown strength of 500 V/?m or higher.

Abstract: A fluororesin film contains a fluororesin. The fluororesin contains two fluororesin species having different composition ratios of polymerized units. The fluororesin film has on at least one surface thereof a ten-point average roughness of 0.100 to 1.200 ?m and an arithmetic average roughness of 0.010 to 0.050 ?m, and the fluororesin film has a breakdown strength of 400 V/?m or higher.

Abstract: A fluororesin film containing a fluororesin. The fluororesin film has on at least one surface thereof a ten-point average roughness of 0.100 to 1.200 ?m and an arithmetic average roughness of 0.010 to 0.050 ?m. Further, the fluororesin film has a breakdown strength of 400 V/?m or higher.

Abstract: A radio wave absorbing material including a fluoropolymer. The fluoropolymer contains a vinylidene fluoride unit, and the radio wave absorbing material absorbs a radio wave having a frequency in a range of 1 MHz to 100 MHz.

Abstract: A film having a dielectric dissipation factor at a frequency of 1 kHz and 160° C. of 0.02% or lower and a dielectric breakdown strength at 160° C. of 400 V/?m or higher. Also disclosed is a film including at least one fluoropolymer selected from a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer, the fluoropolymer having a crystallinity of 65% or higher.

Abstract: The present invention provides a film having excellent heat resistance and a small difference between the permittivity at low temperatures and the permittivity at high temperatures. The present invention provides a film having a relative permittivity of 8 or more at a frequency of 1 kHz at 30° C., wherein the rate of change is ?8 to +8% as calculated from a relative permittivity A at a frequency of 1 kHz at 30° C. and a relative permittivity B at a frequency of 1 kHz at 150° C. according to the following formula: Rate of change(%)=(B?A)/A×100.

Abstract: The invention provides a film having a high relative permittivity, a high volume resistivity, and a high breakdown strength. The film has a relative permittivity of 9 or higher at a frequency of 1 kHz and 30° C., a volume resistivity of 5E+15 ?·cm or higher at 30° C., and a breakdown strength of 500 V/?m or higher.

Abstract: A fluororesin film containing a fluororesin. The fluororesin film has on at least one surface thereof a ten-point average roughness of 0.100 to 1.200 ?m and an arithmetic average roughness of 0.010 to 0.050 ?m. Further, the fluororesin film has a breakdown strength of 400 V/?m or higher.

Abstract: The present invention provides a film having excellent heat resistance and a small difference between the permittivity at low temperatures and the permittivity at high temperatures. The present invention provides a film having a relative permittivity of 8 or more at a frequency of 1 kHz at 30° C., wherein the rate of change is ?8 to +8% as calculated from a relative permittivity A at a frequency of 1 kHz at 30° C. and a relative permittivity B at a frequency of 1 kHz at 150° C. according to the following formula: Rate of change (%)=(B?A)/A×100.

Abstract: The present invention aims to provide a film having a high dielectric constant and a low dissipation factor. The high dielectric film of the present invention includes a vinylidene fluoride/tetrafluoroethylene copolymer (A) with a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 95/5 to 80/20. The film includes an ?-crystal structure and a ?-crystal structure. The ratio of the ?-crystal structure is 50% or more.

Abstract: The present invention aims to provide a multilayer film which can increase the capacitance. The present invention relates to a multilayer film including a first electrode layer, a resin substrate, a second electrode layer, and a dielectric layer stacked in the order set forth. The dielectric layer includes a vinylidene fluoride/tetrafluoroethylene copolymer (A). The copolymer (A) satisfies a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 97/3 to 60/40.

Abstract: Provided is a film for a film capacitor in which electrical insulation, and especially electrical properties at high temperatures are improved while a high dielectric constant of a vinylidene fluoride resin is maintained. The film for a film capacitor includes a tetrafluoroethylene resin (a1) that includes a vinylidene fluoride unit and a tetrafluoroethylene unit in the vinylidene fluoride unit/tetrafluoroethylene unit ratio (mol %) of 0/100 to 49/51 as a film-forming resin (A).

Abstract: The present invention provides a high dielectric film for a film capacitor obtained by molding a film forming composition for a film capacitor comprising a thermoplastic resin (A) and surface-treated high dielectric inorganic particles (B) obtained by treating the surfaces of high dielectric inorganic particles (b1) having a dielectric constant (20° C., 1 kHz) of 100 or more with a low dielectric compound (b2) having a dielectric constant (20° C., 1 kHz) of 10 or less. This high dielectric film for a film capacitor can restrain the decrease of electrical insulating property, in spite of the high dielectric inorganic particles being dispersed at a high filling rate.

Abstract: There is provided a thin highly dielectric film for a film capacitor being excellent in mechanical strength, in which highly dielectric inorganic particles can be blended to a dielectric resin at high ratio, and rubber particles (B) and preferably highly dielectric inorganic particles (C) are dispersed in a thermoplastic resin (A).

Abstract: The present invention provides a nonporous highly dielectric film which can improve withstanding voltage, insulating property and dielectric constant, especially can decrease a dielectric loss at high temperatures and can be made thin, and a coating composition for forming the highly dielectric film comprising (A) a vinylidene fluoride resin, (B) a cellulose resin and (C) a solvent.

Abstract: Provided is a film for a film capacitor in which electrical insulation, and especially electrical properties at high temperatures are improved while a high dielectric constant of a vinylidene fluoride resin is maintained. The film for a film capacitor includes a tetrafluoroethylene resin (a1) that includes a vinylidene fluoride unit and a tetrafluoroethylene unit in the vinylidene fluoride unit/tetrafluoroethylene unit ratio (mol %) of 0/100 to 49/51 as a film-forming resin (A).

Abstract: The present invention provides a high dielectric film comprising: a film-forming resin (A); and inorganic particles (B), wherein the film-forming resin (A) contains a vinylidene fluoride resin (a1), an amount of the inorganic particles (B) is not less than 0.01 parts by mass and less than 10 parts by mass for each 100 parts by mass of the film-forming resin (A), and the inorganic oxide particles (B) is at least one selected from the group consisting of: (B1) inorganic oxide particles of a metallic element of Group 2, 3, 4, 12, or 13 of the Periodic Table, or inorganic oxide composite particles of these; (B2) inorganic composite oxide particles represented by formula (1): M1a1Nb1Oc1 wherein M1 represents a metallic element of Group 2, N represents a metallic element of Group 4, a1 represents 0.9 to 1.1, b1 represents 0.9 to 1.1, c1 represents 2.8 to 3.

Abstract: There is provided a thin highly dielectric film for a film capacitor being excellent in mechanical strength, in which highly dielectric inorganic particles can be blended to a dielectric resin at high ratio, and rubber particles (B) and preferably highly dielectric inorganic particles (C) are dispersed in a thermoplastic resin (A).

Abstract: The present invention provides a high dielectric film for a film capacitor obtained by molding a film forming composition for a film capacitor comprising a thermoplastic resin (A) and surface-treated high dielectric inorganic particles (B) obtained by treating the surfaces of high dielectric inorganic particles (b1) having a dielectric constant (20° C., 1 kHz) of 100 or more with a low dielectric compound (b2) having a dielectric constant (20° C., 1 kHz) of 10 or less. This high dielectric film for a film capacitor can restrain the decrease of electrical insulating property, in spite of the high dielectric inorganic particles being dispersed at a high filling rate.