Abstract: A lead frame includes an electrode, a hanger lead, and an outer frame and is formed integrally with a supporting member supporting the electrode, so that a package having a depression in which a light-emitting element will be mounted is formed. The depression is open on the upper side, its side walls are mainly constituted of the supporting member, and at least a part of its bottom surface includes the electrode. The electrode is disposed in a supporting member forming region. The hanger lead extends from the outer frame to reach the supporting member forming region. A chamfered surface is formed on at least a part of an upper side corner of an end of the hanger lead.

Abstract: A package includes a first electrode, a second electrode, a wall, and a flange. The polarity of the second electrode is different from that of the first electrode, and at least one of the first electrode and the second electrode has an outer lead component that has a recess formed at a distal end. The wall fixes the first electrode and the second electrode, constitutes a side wall of a bottomed concave component in which at least part of a bottom surface of the bottomed concave component is constituted by the first electrode and the second electrode, and has the outer lead component protruded therefrom. The flange protrudes outward from the wall, and is provided with the same thickness as the outer lead component, on two sides of the outer lead component in plan view where the recess is not formed.

Abstract: A method for manufacturing a package includes the steps of; preparing a lead frame having a frame, a first electrode, a second electrode, a first connecting portion connecting the frame and the first electrode, and a second connecting portion connecting the frame and the second electrode; placing the lead frame in a mold; injecting a first resin into the mold from an inlet of the mold located adjacent to the first electrode to mold a flange portion and a wall portion of the package; and cutting the lead frame and a part of the flange portion located adjacent to the first electrode. In the step of injecting the first resin, the mold and the lead frame together provide a hollow space into which the first resin is injected and in which a part of the flange portion is formed so as to have a thickness different from a thickness of the lead frame.

Abstract: A method for manufacturing a package includes a step of injecting a first resin through an injection port of a dies in which a lead frame has been placed. The method includes a step of cutting out a portion of a border between a first electrode and a first connection portion running through a first through hole, and cutting out a portion of a border between a second electrode and a second connection portion running through a second through hole after molding the first resin. The method includes a step of electroplating the first and second electrodes. The method includes a step of cutting out a remaining portion of the border between the first electrode and the first connection portion, and cutting out a remaining portion of the border between the second electrode and the second connection portion.

Abstract: A package has a first electrode, a second electrode, and a first resin body. The first resin body has a retainer portion and a wall portion. The retainer portion retains the first electrode and the second electrode and forms a bottom portion of the package together with the first electrode and the second electrode. The wall portion surrounds a mounting region on the bottom portion and has a pair of opposite outer sides. Each of the first electrode and the second electrode has an outer lead portion extending outwardly from respective one of the pair of opposite outer sides of the wall portion. The first resin body further has a flange portion having parts extending from the pair of opposite outer sides of the wall portion. Each of the outer lead portions extends outwardly beyond a distal end of the corresponding part of the flange portion in plan view.

Abstract: A method for manufacturing a package, includes preparing a lead frame that, in a region where the package is to be formed, has a first electrode and a second electrode that is different from the first electrode; clamping the first electrode and the second electrode between an upper molding die and a lower molding die; injecting a first resin into the molding dies between which the first electrode and the second electrode have been clamped, through an injection opening formed adjacent to the first electrode and on the outside of the region where the package is to be formed; curing or solidifying the injected first resin; and cutting out an injection mark of the injection opening for the first resin from next to the first electrode after the first resin has been cured or solidified.

Abstract: A lead frame includes a first electrode, a second electrode, two hanger leads, and an outer frame, and partially forms a box-shaped package which has a first recess for mounting a light emitting element as combined with a support member that supports the first electrode and the second electrode. At least a portion of lower faces of the electrodes, at least a portion of lower faces of the hanger leads, and at least a portion of a lower face of the planned formation area for the support member are coplanarly formed. Lower face corners of the first electrode and the second electrode are rounded while upper face corners of the first electrode and the second electrode are not rounded, and upper face corners of the hanger leads are rounded while lower face corners of the hanger leads are not rounded.

Abstract: A method for manufacturing a package, includes preparing a lead frame that, in a region where the package is to be formed, has a first electrode and a second electrode that is different from the first electrode; clamping the first electrode and the second electrode between an upper molding die and a lower molding die; injecting a first resin into the molding dies between which the first electrode and the second electrode have been clamped, through an injection opening formed adjacent to the first electrode and on the outside of the region where the package is to be formed; curing or solidifying the injected first resin; and cutting out an injection mark of the injection opening for the first resin from next to the first electrode after the first resin has been cured or solidified.

Abstract: The SSD performs to encode input data from the host device into BCH code having data length and code length sequentially and controls RRAM to stores the encoded data when the write requesting signal is input from the host device. When the number of BCH code that becomes data of one page of the flash memory after being decoded is stored to RRAM, the SSD controls RRAM to read out data stored in RRAM, performs error correction and decoding to the read data as BCH code having the data length and the code length, and controls the flash memory to store the encoded data.

Abstract: When write data D is high rewritten data, a PC 10 controls a DRAM 24 to store the write data D (steps S100 and S110). When the write data D is not the high rewritten data, the PC 10 outputs an RRAM write request signal and the write data D to an SSD (step S100 and S120). A memory controller of the SSD input the RRAM write request signal controls the RRAM and an SRAM to store the write data D in the RRAM or the SRAM. This treatment enables data stored in the DRAM to be rewritten frequently. Therefore, the decrease of number of times of refresh operation of the DRAM and the decrease of power consumption are accomplished.

Abstract: When write request signal is input from a host device, an SSD inputs data input from the host device in an encoder sequentially and controls a RRAM to store data output from the encoder. When size of data stored in the RRAM reaches predetermined size Sref, the SSD controls the RRAM to read out data of size of the predetermined size Sref, inputs read data from the RRAM in the encoder, and controls a flash memory to store data output from the encoder. This configuration accomplishes the increase of the data write speed and improvement of reliability of the data.

Abstract: When write request signal is input from a host device 10, an SSD 20 inputs data input from the host device 10 in an encoder 30 sequentially and controls a RRAM 24 to store data output from the encoder 30. When size of data stored in the RRAM 24 reaches predetermined size Sref, the SSD 20 controls the RRAM 24 to read out data of size of the predetermined size Sref, inputs read data from the RRAM 24 in the encoder 32, and controls a flash memory 22 to store data output from the encoder 32. This configuration accomplishes the increase of the data write speed and improvement of reliability of the data.

Abstract: When write data D is high rewritten data, a PC 10 controls a DRAM 24 to store the write data D (steps S100 and S110). When the write data D is not the high rewritten data, the PC 10 outputs an RRAM write request signal and the write data D to an SSD (step S100 and S120). A memory controller of the SSD input the RRAM write request signal controls the RRAM and an SRAM to store the write data D in the RRAM or the SRAM. This treatment enables data stored in the DRAM to be rewritten frequently. Therefore, the decrease of number of times of refresh operation of the DRAM and the decrease of power consumption are accomplished.

Abstract: The SSD performs to encode input data from the host device into BCH code having data length Sdr and code length Scr sequentially (step S100 and step S110) and controls RRAM to stores the encoded data (step S120) when the write requesting signal is input from the host device. When the number of BCH code that becomes data of one page of the flash memory after being decoded is stored to RRAM (step S130), the SSD controls RRAM to read out data stored in RRAM (step S140), performs error correction and decoding to the read data as BCH code having the data length Sdr and the code length Scr, and controls the flash memory to store the encoded data.