Abstract: The present invention relates to small cationic ortho-5,15-di-heteroaryl porphyrin derivatives, in particular porphyrins, chlorins or bacteriochlorin of formula (I) or pharmaceutically acceptable salts thereof. This invention also relates to the use of the above-mentioned cationic ortho-5,10-di-heteroaryl porphyrin derivatives of Formula (I) or a pharmaceutically acceptable salts thereof, in photodynamic inactivation of microorganisms, where the referred derivatives are able to treat the same in the presence of an adequate light. The present invention also describes pharmaceutical compositions comprising one or more of the cationic ortho-5,10-di-heteroaryl porphyrin derivatives, in particular prophyrins, chlorins or bacteriochlorins of Formula (I), or pharmaceutically acceptable salts thereof, for the treatment of bacterial and/or fungi and/or yeasts and/or viral infections, in humans or animals.

Abstract: The present invention describes methods for obtaining functionalized polymeric surfaces (MPn-PSm) from polymers or copolymers with appropriate functionalizations (X), which can be a halogen of a leaving group, such as polyvinyl chloride (MP1) and (chloromethyl)polystyrene-Merrifield (MP2), and curcumin photosensitizers (PS1), meso-tetra(aryl)porphyrins, chlorins or bacteriochlorins halogenated and functionalized with nucleophilic groups (PS2), in particular including P2 of the type meso-imidazoyl-porphyrins, chlorins or bacteriochlorins (PS3). The structures of all the photosensitizers in the present application incorporate a functional group (Y), which is a OH, SH or NH2nucleophile. The application also describes the covalent bonding process of the photosensitizers PS1-PS3 to the functional polymeric materials MP1-MP2 by means of a nucleophilic substitution reaction to prepare the MPn-Psm products.

Abstract: A sheet-framed IC carrier has a sheet frame having an aperature, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperature of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is stuck on the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.