Abstract: A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the composition, and a crack-free silica-based coating film formed using the composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

Abstract: A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

Abstract: A coloring agent dispersion which contains a satisfactorily dispersed pigment, and results in a photosensitive resin composition capable of forming a cured film when mixed in the photosensitive resin composition; a photosensitive resin composition containing the coloring agent dispersion; a cured product of the composition; an organic EL element provided with the cured product; a method for forming a pattern using the composition; and a method for producing a photosensitive resin composition using the dispersion. In a coloring agent dispersion including a coloring agent which contains a pigment and a dispersant, a dispersant containing a silsesquioxane compound of a specific structure is used.

Abstract: A transparent body production method that includes subjecting the compound represented by formula (1) to heating at a temperature equal to or greater than the melting point of said compound. In formula (1), each of W1 and W2 is the group represented by formula (2) in which the ring Z is an aromatic hydrocarbon ring, X is a single bond or —S—, R1 is a single bond or an alkylene group having 1-4 carbon atoms, R2 is a specific substituent, and m is an integer of 0 or higher, the group represented by formula (4) is —OH— or a (meth)acryloyloxy group, each of the rings Y1 and Y2 is an aromatic hydrocarbon ring, R is a single bond or a specific divalent group, each of R3a and R3b is —CN, a halogen group, or a monovalent hydrocarbon group, and each of n1 and n2 is an integer of 0-4.

Abstract: A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

Abstract: A coloring agent dispersion which contains a satisfactorily dispersed pigment, and results in a photosensitive resin composition capable of forming a cured film when mixed in the photosensitive resin composition; a photosensitive resin composition containing the coloring agent dispersion; a cured product of the composition; an organic EL element provided with the cured product; a method for forming a pattern using the composition; and a method for producing a photosensitive resin composition using the dispersion. In a coloring agent dispersion including a coloring agent which contains a pigment and a dispersant, a dispersant containing a silsesquioxane compound of a specific structure is used.

Abstract: A transparent body production method that includes subjecting the compound represented by formula (1) to heating at a temperature equal to or greater than the melting point of said compound. In formula (1), each of W1 and W2 is the group represented by formula (2) in which the ring Z is an aromatic hydrocarbon ring, X is a single bond or —S—, R1 is a single bond or an alkylene group having 1-4 carbon atoms, R2 is a specific substituent, and m is an integer of 0 or higher, the group represented by formula (4) is —OH— or a (meth)acryloyloxy group, each of the rings Y1 and Y2 is an aromatic hydrocarbon ring, R is a single bond or a specific divalent group, each of R3a and R3b is —CN, a halogen group, or a monovalent hydrocarbon group, and each of n1 and n2 is an integer of 0-4.

Abstract: A novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure. The compound is represented by the following formula (1). In the formula, R1 and R2 each independently represents a hydrogen atom or an organic group, but at least one represents an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 represents a single bond or an organic group. R4 to R9 each independently represents a hydrogen atom, an organic group, etc., but R6 and R7 are not hydroxyl groups. R10 represents a hydrogen atom or an organic group.

Abstract: A negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure; a pattern forming method using the resin composition; a cured film, an insulating film, a color filter formed using resin composition; and a display device provided with the cured film, insulating film, or color filter. The resin composition contains a compound represented by the following formula (1). In the formula, R1 and R2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 indicates a single bond or an organic group. R4 to R9 each independently indicate a hydrogen atom, an organic group, etc., but R6 and R7 are never hydroxyl groups. R10 indicates a hydrogen atom or an organic group.

Abstract: A photosensitive resin composition having excellent storage stability which can form a high precision pattern upon a low amount of exposure; a method of forming a pattern including a polysiloxane coating with the photosensitive resin composition; and an electronic component including a pattern including a polysiloxane coating formed with the photosensitive resin composition. A compound which generates an imidazole compound having a predetermined structure by light is added to a photosensitive resin composition including one or more hydrolyzable silane compounds, hydrolysates of the hydrolyzable silane compounds and condensates thereof and a photo-base generator or a photo-acid generator.

Abstract: A negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure; a pattern forming method using the resin composition; a cured film, an insulating film, a color filter formed using resin composition; and a display device provided with the cured film, insulating film, or color filter. The resin composition contains a compound represented by the following formula (1). In the formula, R1 and R2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 indicates a single bond or an organic group. R4 to R9 each independently indicate a hydrogen atom, an organic group, etc., but R6 and R7 are never hydroxyl groups. R10 indicates a hydrogen atom or an organic group.

Abstract: A novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure. The compound is represented by the following formula (1). In the formula, R1 and R2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 indicates a single bond or an organic group. R4 to R9 each independently indicate a hydrogen atom, an organic group, etc., but R6 and R7 are never hydroxyl groups. R10 indicates a hydrogen atom or an organic group.

Abstract: A photosensitive resin composition having excellent storage stability which can form a high precision pattern upon a low amount of exposure; a method of forming a pattern including a polysiloxane coating with the photosensitive resin composition; and an electronic component including a pattern including a polysiloxane coating formed with the photosensitive resin composition. A compound which generates an imidazole compound having a predetermined structure by light is added to a photosensitive resin composition including one or more hydrolyzable silane compounds, hydrolysates of the hydrolyzable silane compounds and condensates thereof and a photo-base generator or a photo-acid generator.