Patents by Inventor Mayumi Osumi

Mayumi Osumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
    Patent number: 6379997
    Abstract: A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: April 30, 2002
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Toshimi Kawahara, Sinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiquro, Yoshitugu Katoh, Junichi Kasai, Shinichirou Taniguchi, Yuji Sakurai
  • Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
    Patent number: 6111306
    Abstract: A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.
    Type: Grant
    Filed: October 6, 1997
    Date of Patent: August 29, 2000
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Toshimi Kawahara, Sinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiguro, Yoshitugu Katoh, Junichi Kasai, Shinichirou Taniguchi, Yuji Sakurai
  • Semiconductor integrated circuit device having stacked wiring and insulating layers
    Patent number: 6034428
    Abstract: A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: March 7, 2000
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Toshimi Kawahara, Hiroyuki Ishiguro, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi, Shinya Nakaseko, Yoshitugu Katoh, Junichi Kasai
  • Semiconductor device and method of producing the same
    Patent number: 5804467
    Abstract: A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.
    Type: Grant
    Filed: May 13, 1997
    Date of Patent: September 8, 1998
    Assignees: Fujistsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Toshimi Kawahara, Shinya Nakaseko, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi, Hiroyuki Ishiguro, Yoshitugu Katoh, Junichi Kasai
  • Semiconductor device having resin gate hole through substrate for resin encapsulation
    Patent number: 5679978
    Abstract: A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.
    Type: Grant
    Filed: October 24, 1994
    Date of Patent: October 21, 1997
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Toshimi Kawahara, Shinya Nakaseko, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi, Hiroyuki Ishiguro, Yoshitugu Katoh, Junichi Kasai
  • Methods for making metal particle spherical and removing oxide film solder paste and soldering method
    Patent number: 5616164
    Abstract: Metal such as solder is immersed in a heating medium containing a rosin or derivative thereof and an organic solvent and heated to a temperature above the melting point of the metal, to remove the oxide film of the metal and make the metal spherical. If a hardened caster oil or high softening point rosin or derivative thereof is further added as a thickener to the heating medium, the size increase of the metal particle can be prevented. By heating at a temperature lower than the melting point of the metal, the oxide film can be removed without making the particles spherical. Using thus obtained solder particles, fluxless soldering can be done. Also, a fluxless soldering method is provided.
    Type: Grant
    Filed: January 3, 1995
    Date of Patent: April 1, 1997
    Assignee: Fujitsu Limited
    Inventors: Masayuki Ochiai, Kaoru Hashimoto, Toshimi Kawahara, Mayumi Osumi