Abstract: Provided is a semiconductor module, including: a first switching device provided in one of an upper arm or a lower arm; a second switching device provided in another of the upper arm or the lower arm; a first diode device provided in parallel with the first switching device; a second diode device provided in parallel with the second switching device; a laminated substrate of which a main surface has two sides extending in a predetermined first direction and a predetermined second direction; and a gate external terminal and an auxiliary source external terminal provided farther toward a negative side of the first direction than the upper arm and the lower arm, and arranged in the second direction.

Abstract: A semiconductor module, including a plurality of semiconductor elements, each of which has a main electrode and a control electrode, an enclosure that encloses the plurality of semiconductor elements, a plurality of first connection terminals, each of which is electrically connected to the control electrode of one of the semiconductor elements and extends from the enclosure, and a plurality of second connection terminals, each of which is electrically connected to the main electrode of one of the semiconductor elements and extends from the enclosure. Each of the second connection terminals includes a press-fit part formed in substantially a plate shape having two plate surfaces. For a portion of the press-fit part, the two plate surfaces thereof are separated from each other in a thickness direction of the press-fit part, at least one of the plate surfaces thereof having elasticity, to thereby form an elastic part of the press-fit part.