Patents by Inventor Md Altai Hossain

Md Altai Hossain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11031341
    Abstract: A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: June 8, 2021
    Assignee: Intel Corporation
    Inventors: Md Altai Hossain, Kevin J Doran, Yu Amos Zhang, Zhiguo Qian