Abstract: A photonic system and a method for analysing target molecules that emit radiation upon being exposed to excitation radiation includes a radiation source configured to provide excitation radiation with a predetermined polarization state, and a photonics chip that includes an analysis region for exposing target molecules to radiation from the radiation source, so that target molecules with a dipole component along the direction of polarization of the excitation radiation emit radiation with an angular profile. A waveguide structure captures radiation emitted from the analysis region by target molecules. The waveguide structure is configured to extract the emitted radiation in different positions in accordance with the angular profile of the emitted radiation for sampling the angular profile.

Abstract: A method for manufacturing of a waveguide for guiding an electro-magnetic wave comprising: forming a first waveguide layer, a sacrificial layer and a protection layer on a first wafer, patterning to define a pattern of a first waveguide part and a supporting structure in the first waveguide layer; exposing the sacrificial layer on the first waveguide part while the protection layer still covers the sacrificial layer on the supporting structure; removing the sacrificial layer on the first waveguide part; removing the protection layer; bonding a second wafer to the sacrificial layer of the first wafer such that a second waveguide part is supported by the supporting structure and a gap corresponding to the thickness of the sacrificial layer is formed between the first and second waveguide parts.

Abstract: A method for manufacturing of a waveguide for guiding an electro-magnetic wave comprising: forming a first waveguide layer, a sacrificial layer and a protection layer on a first wafer, patterning to define a pattern of a first waveguide part and a supporting structure in the first waveguide layer; exposing the sacrificial layer on the first waveguide part while the protection layer still covers the sacrificial layer on the supporting structure; removing the sacrificial layer on the first waveguide part; removing the protection layer; bonding a second wafer to the sacrificial layer of the first wafer such that a second waveguide part is supported by the supporting structure and a gap corresponding to the thickness of the sacrificial layer is formed between the first and second waveguide parts.