Abstract: A semiconductor device is provided that includes a substrate, an integrated circuit with a conductive member and a through-substrate-via (TSV) structure. The substrate includes a front surface and a back surface that is opposite the front surface. The integrated circuit with the conductive member is formed over the front surface of the substrate. The TSV structure having vertical sidewalls is formed in the back surface of the substrate connecting with the conductive member. The TSV structure includes a tapered first insulation layer, a conformal conductive layer and a second insulation layer, with the conformal conductive layer positioned between the first and second insulation layers. The conformal conductive layer is electrically connected to the conductive member.

Abstract: The present disclosure relates to packaging of integrated circuit chips for semiconductor devices. More particularly, the present disclosure relates to packaging of multiple chips for silicon photonics devices. The present disclosure provides a semiconductor device including a photonic integrated circuit (PIC) chip, an inductor positioned over the PIC chip, and a transimpedance amplifier (TIA) chip positioned over the PIC chip. The inductor has a first terminal end and a second terminal end, and the first terminal end is connected to the PIC chip.

Abstract: A semiconductor device is provided that includes a substrate, an integrated circuit with a conductive member and a through-substrate-via (TSV) structure. The substrate includes a front surface and a back surface that is opposite the front surface. The integrated circuit with the conductive member is formed over the front surface of the substrate. The TSV structure having vertical sidewalls is formed in the back surface of the substrate connecting with the conductive member. The TSV structure includes a tapered first insulation layer, a conformal conductive layer and a second insulation layer, with the conformal conductive layer positioned between the first and second insulation layers. The conformal conductive layer is electrically connected to the conductive member.

Abstract: The present disclosure relates to packaging of integrated circuit chips for semiconductor devices. More particularly, the present disclosure relates to packaging of multiple chips for silicon photonics devices. The present disclosure provides a semiconductor device including a photonic integrated circuit (PIC) chip, an inductor positioned over the PIC chip, and a transimpedance amplifier (TIA) chip positioned over the PIC chip. The inductor has a first terminal end and a second terminal end, and the first terminal end is connected to the PIC chip.

Abstract: A product disclosed herein includes an RF filter die including an RF filter, a front side and a plurality of conductive bond pads conductively coupled to at least a portion of the RF filter, wherein at least a portion of the conductive bond pads is exposed on the front side of the RF filter die. The product also includes a TSV (Through-Substrate-Via) die that includes a plurality of conductive TSV contacts positioned on a back side of the TSV die and at least one conductive TSV (Through-Substrate-Via) structure that is conductively coupled to at least one of the plurality of conductive TSV contacts, wherein the back side of the TSV die is bonded to the front side of the RF filter such that the conductive bond pads on the RF filter die are conductively coupled to corresponding conductive TSV contacts positioned on the back side of the TSV die.

Abstract: A semiconductor device comprising an on-mold antenna for transmitting and/or receiving a millimeter-wave radio frequency signal is provided. The semiconductor device includes a semiconductor layer; a polymer layer proximal to the semiconductor layer; a mold proximal to the polymer layer; a plurality of nodes proximal to the semiconductor layer and distal to the polymer layer; an antenna disposed on the mold; and a conductive element providing electrical communication between the antenna and a first node. The mold may be from 500 ?m to 1000 ?m thick, such as from 750 ?m to 800 ?m thick, such as about 775 ?m.

Abstract: A semiconductor device comprising an on-mold antenna for transmitting and/or receiving a millimeter-wave radio frequency signal is provided. The semiconductor device includes a semiconductor layer; a polymer layer proximal to the semiconductor layer; a mold proximal to the polymer layer; a plurality of nodes proximal to the semiconductor layer and distal to the polymer layer; an antenna disposed on the mold; and a conductive element providing electrical communication between the antenna and a first node. The mold may be from 500 ?m to 1000 ?m thick, such as from 750 ?m to 800 ?m thick, such as about 775 ?m.

Abstract: A product disclosed herein includes an RF filter die including an RF filter, a front side and a plurality of conductive bond pads conductively coupled to at least a portion of the RF filter, wherein at least a portion of the conductive bond pads is exposed on the front side of the RF filter die. The product also includes a TSV (Through-Substrate-Via) die that includes a plurality of conductive TSV contacts positioned on a back side of the TSV die and at least one conductive TSV (Through-Substrate-Via) structure that is conductively coupled to at least one of the plurality of conductive TSV contacts, wherein the back side of the TSV die is bonded to the front side of the RF filter such that the conductive bond pads on the RF filter die are conductively coupled to corresponding conductive TSV contacts positioned on the back side of the TSV die.