Abstract: A method of discovering relay agent in a wireless communications system is provided. A wireless station first sends a relay solicitation frame to query availability of relay agent. The wireless station then receives one or more relay acknowledgement frames from one or more candidate relay agents in response to the relay solicitation frames. The wireless station determines a selected relay agent, and establishes a wireless link with the selected relay agent. The selected relay agent performs data forwarding between the station and an access point. The method allows a wireless station to initiate the relay agent discovery process by soliciting a specific relay agent or broadcasting a request to all potential relay agents. The selected relay agent can be determined with minimum power and based on link quality associated with the relay agent and specific requirement of the wireless station.

Abstract: A communication apparatus and a method for providing a predetermined subscriber identification module (SIM) card are provided. The communication apparatus provides different man-machine interfaces (MMIs) according to a number of the inserted SIM cards. The communication apparatus includes a detector arranged to detect an amount of the inserted SIM cards on the communication apparatus, and a processor arranged to provide different MMIs according to the amount of inserted SIM cards.

Abstract: A high-definition multimedia interface (HDMI) receiver apparatus is provided. The HDMI receiver apparatus includes a pin, a control module, and an extended display identification data (EDID) module. The pin is used to receive an HDMI cable connection voltage in a first operation state and output a hot plug detection signal in a second operation state. The control module is connected with the pin. When the pin receives the HDMI cable connection voltage in the first operation state, the control module switches the pin to the second operation state from the first operation state and outputs the hot plug detection signal to an HDMI transmitter apparatus through the pin, such that the HDMI transmitter apparatus reads EDID information according to the hot plug detection signal. The EDID module is used to store the EDID information.

Abstract: A wireless communication unit is described that includes a transceiver; at least one antenna port operably coupled to the transceiver via at least one antenna switch; a radio frequency part of the transceiver that includes at least one tuneable radio frequency (RF) component; and a test signal generator for generating an RF test signal for receiver calibration. The radio frequency part includes a coupler located between the at least one tuneable RF component and the at least one antenna switch for coupling the RF test signal to or from the radio frequency part for calibration.

Abstract: A cache device, coupled to a processing device, a plurality of system components and an external memory control module, capable of exchanging all types of traffic streams from the processing device and the plurality of system components to the external memory control module. The cache device includes a plurality of cache units, comprising a plurality of cache lines and corresponding to a plurality of cache sets; a data accessing unit, coupled to the processing device, the plurality of system components, the plurality of cache units and the external memory control module, capable of exchanging data of the processing device, the plurality of cache units and an external memory device coupled to the external memory control module according to at least one request signal from the processing device and the plurality of system components.

Abstract: The performance, thermal and power management system is configured to perform DVFS calibration, temperature compensation adjustment, aging calibration, and DC offset calibration in an IC. The initial voltage supplied to the IC may be set to an initial value which takes chip-to-chip process variations into account and then dynamically adjusted according to temperature variations, DC offset and/or aging effects. Therefore, the performance, thermal and power management system may achieve optimized thermal and power performance of the IC.

Abstract: Embodiments of a printed circuit board (PCB) and an electronic apparatus are provided. The PCB includes a PCB substrate and a plurality of the pads. The PCB substrate is disposed with the plurality of the pads. The plurality of the pads include a first type of the pads and a second type of the pads. The first type of the pads adopts the solder mask defined structure, and the second type of the pads adopts the non-solder mask defined structure.