Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: An apparatus and method are described for synchronizing distribution of packet information. In one embodiment, the invention includes timestamp processing logic to process a transmit time indicator embedded within the packet information, where the transmit time indicator is based on a time reference, and service synchronization queuing logic to hold the packet information until a time offset after the transmit time indicator, where the service synchronization queuing logic is synchronized to the time reference.

Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: An apparatus and method are described for forwarding of packets with controlled delay. In one embodiment, the invention includes controlled delay queuing logic to hold a packet in a first class for a queuing time of at least a controlled delay value, and scheduling logic to determine whether to delay transmission of a packet in a second class to allow the transmission of the packet in the first class when the queuing time reaches the controlled delay value.

Abstract: An apparatus and method are described to increase the control resolution of an electronic device. In one embodiment, the invention includes a spread pulse modulation module to generate a first set of bits based on a second set of bits that is larger than the first set of bits. The spread pulse modulation module modulates the least significant bit (LSB) of the first set of bits based on information including the LSB modulation period and the LSB modulation duty cycle. The spread pulse modulation module also modulates the least significant bit of the first set of bits so that the least significant bit transitions at least twice from a high value to a low value during the modulation period. This embodiment of the invention also includes a digital-to-analog conversion module to generate an analog input signal to the electronic device based on the first set of bits.

Abstract: An apparatus and method are described for synchronizing distribution of packet information. In one embodiment, the invention includes timestamp processing logic to process a transmit time indicator embedded within the packet information, where the transmit time indicator is based on a time reference, and service synchronization queuing logic to hold the packet information until a time offset after the transmit time indicator, where the service synchronization queuing logic is synchronized to the time reference.

Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: An apparatus and method are described to increase the control resolution of an electronic device. In one embodiment, the invention includes a spread pulse modulation module to generate a first set of bits based on a second set of bits that is larger than the first set of bits. The spread pulse modulation module modulates the least significant bit (LSB) of the first set of bits based on information including the LSB modulation period and the LSB modulation duty cycle. The spread pulse modulation module also modulates the least significant bit of the first set of bits so that the least significant bit transitions at least twice from a high value to a low value during the modulation period. This embodiment of the invention also includes a digital-to-analog conversion module to generate an analog input signal to the electronic device based on the first set of bits.

Abstract: An apparatus and method are described for forwarding of packets with controlled delay. In one embodiment, the invention includes controlled delay queuing logic to hold a packet in a first class for a queuing time of at least a controlled delay value, and scheduling logic to determine whether to delay transmission of a packet in a second class to allow the transmission of the packet in the first class when the queuing time reaches the controlled delay value.